Abstract: An apparatus may include an enclosure that includes a plurality of mounting features that are configured to receive information handling systems; one or more environmental sensors configured to determine environmental conditions associated with the enclosure; a position sensor configured to determine a geodetic location of the enclosure; a heater configured to heat the enclosure; and a heater control system. The heater control system may be configured to: receive information regarding an origin for the enclosure, a destination for the enclosure, and a desired destination temperature for the enclosure; establish a model for the enclosure, wherein the model incorporates data from the one or more environmental sensors and data from the position sensor; and based on the model, predictively determining control parameters for the heater configured to cause the enclosure to reach the desired destination temperature at or before a time of arrival at the destination.

Abstract: Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Abstract: Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Abstract: A system may include an input for receiving a stimulus to modify a power state of the system and a controller configured to monitor for user interaction with the input and in response to user interaction with the input, communicate a message via a vendor-defined message over a communications interface to a second controller integral to an information handling system, wherein such second controller is configured to replicate the message to a management controller integral to the information handling system to cause the management controller to change a power state of the information handling system.

Abstract: An apparatus may include an enclosure that includes a plurality of mounting features that are configured to receive information handling systems; one or more environmental sensors configured to determine environmental conditions associated with the enclosure; a position sensor configured to determine a geodetic location of the enclosure; a heater configured to heat the enclosure; and a heater control system. The heater control system may be configured to: receive information regarding an origin for the enclosure, a destination for the enclosure, and a desired destination temperature for the enclosure; establish a model for the enclosure, wherein the model incorporates data from the one or more environmental sensors and data from the position sensor; and based on the model, predictively determining control parameters for the heater configured to cause the enclosure to reach the desired destination temperature at or before a time of arrival at the destination.

Abstract: Systems and methods for component population optimization are described. In some embodiments, an Information Handling System (IHS) may include a logic circuit and a memory coupled to the logic circuit, the memory having information stored thereon that, upon access by the logic circuit, enable the IHS to: identify a connector provided on a Printed Circuit Board (PCB), wherein the connector is configured to receive a device and to couple the device to a processor; and visually indicate a status of the connector.

Abstract: Systems and methods for component population optimization are described. In some embodiments, an Information Handling System (IHS) may include a logic circuit and a memory coupled to the logic circuit, the memory having information stored thereon that, upon access by the logic circuit, enable the IHS to: identify a connector provided on a Printed Circuit Board (PCB), wherein the connector is configured to receive a device and to couple the device to a processor; and visually indicate a status of the connector.