Patents by Inventor Chris O'Clair

Chris O'Clair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230345277
    Abstract: Systems and methods for monitoring and managing mesh-based communication systems include providing an interactive network map of a mesh-based communication system and wireless communication nodes of the mesh-based communication system, facilitating selection of and actioning for one or more of the wireless communication nodes, generating, managing, and visualizing alerts related to operation and performance of the mesh-based communication system, and evaluating operational performance of wireless communication nodes of the mesh-based communication system in order to identify points of failure and determine remedial action.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 26, 2023
    Inventors: Bryce Barrand, Chris O'Toole, Clinton Andrews, Julius Zaromskis, Shane Jarrett, Matthew Elliot
  • Publication number: 20230344906
    Abstract: Systems and methods for monitoring and managing mesh-based communication systems include providing an interactive network map of a mesh-based communication system and wireless communication nodes of the mesh-based communication system, facilitating selection of and actioning for one or more of the wireless communication nodes, generating, managing, and visualizing alerts related to operation and performance of the mesh-based communication system, and evaluating operational performance of wireless communication nodes of the mesh-based communication system in order to identify points of failure and determine remedial action.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 26, 2023
    Inventors: Bryce Barrand, Chris O'Toole, Clinton Andrews, Julius Zaromskis, Shane Jarrett, Matthew Elliot
  • Publication number: 20230345258
    Abstract: A computing platform is configured to: (i) receive input data identifying (a) planned infrastructure sites at which to install wireless communication nodes for a wireless mesh network, wherein each planned infrastructure site is associated with a respective wireless communication node to be installed at the planned infrastructure site and (b) planned interconnections between the planned infrastructure sites that specify a manner in which the wireless communication nodes of the planned infrastructure sites are to be interconnected together via wireless links; (ii) receive template data for defining a deployment plan for wireless communication nodes and wireless communication links; and (iii) based at least on the input data and the template data, generate a deployment plan for the planned infrastructure sites that comprises, for each planned infrastructure site, a respective set of configuration data for the respective wireless communication node to be installed at the planned infrastructure site.
    Type: Application
    Filed: April 20, 2023
    Publication date: October 26, 2023
    Inventors: Bryce Barrand, Chris O'Toole, Clinton Andrews, Julius Zaromskis, Brianna Carver, Chad Dewey, Hal Bledsoe, Muhammad Ahsan Naim
  • Publication number: 20230099963
    Abstract: This application is directed to recognizing unstructured information based on hints provided by structured information. A computer system obtains unstructured information collected from a handwritten or audio source, and identifies one or more terms from the unstructured information. The one or more terms includes a first term that is ambiguous. The computer system performs a recognition operation on the first term to derive a first plurality of candidate terms for the first term, and obtains first contextual information from an information template associated with the unstructured information. In accordance with the first contextual information, the computer system selects a first answer term from the first plurality of candidate terms, such that the first term is recognized as the first answer term.
    Type: Application
    Filed: December 7, 2022
    Publication date: March 30, 2023
    Inventors: Chris O'Neill, Andrew Malcolm, Alexander Pashintsev, Eugene Livshitz, Boris Gorbatov, Natalia Galaktionova, IIya Buryak
  • Publication number: 20230041856
    Abstract: A process for fabricating a transversely-excited film bulk acoustic resonator (XBAR) and that XBAR are described. A sacrificial pillar is formed on a surface of a piezoelectric wafer and a highly conforming dielectric layer is deposited on the piezoelectric wafer to bury the sacrificial pillar. The highly conforming dielectric layer is polished to form a planar surface and to leave a thickness of the highly conforming dielectric that covers the sacrificial pillar. The planar surface of the highly conforming dielectric layer is bonded to a surface of a substrate wafer. A conductor pattern is formed on a front surface of the piezoelectric plate and holes are formed through the piezoelectric wafer to the sacrificial pillar. The sacrificial pillar is removed using an etchant introduced through the holes in the piezoelectric wafer to form a cavity under a diaphragm of the piezoelectric wafer spanning the cavity.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 9, 2023
    Inventors: Andrew Kay, Albert Cardona, Chris O'Brien, Akanksha Saha
  • Publication number: 20230034595
    Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a front surface and an intervening oxide layer on the front surface and having a cavity. A thickness of the intervening oxide layer defines a depth of the cavity, and the substrate has vertical etch-stop material for etching the intervening oxide layer. Lateral fences formed in the intervening oxide layer define a perimeter of the cavity. The lateral fences has a lateral etch-stop material for etching the intervening oxide layer. A single-crystal piezoelectric plate has a back surface attached to the front surface of the intervening oxide layer except for a portion of the piezoelectric plate forming a diaphragm that spans the cavity. An interdigital transducer is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm.
    Type: Application
    Filed: June 2, 2022
    Publication date: February 2, 2023
    Inventors: Albert Cardona, Chris O'Brien, Akanksha Saha, Andrew Kay
  • Publication number: 20230037168
    Abstract: A process for fabricating a transversely-excited film bulk acoustic resonator (XBAR) having a metal cavity, and the fabricated XBAR include forming a conductor pattern including interleaved interdigital transducer (IDT) fingers on a piezoelectric wafer. Thein forming a metal layer on a substrate, the metal layer having a cavity. Then, bonding the piezoelectric plate to the metal layer using a metal-to-metal bond such that the IDT fingers are disposed over the cavity. Then, thinning the piezoelectric wafer to form a piezoelectric plate having a portion of the piezoelectric plate forming a diaphragm that spans the cavity.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 2, 2023
    Inventors: Albert Cardona, Andrew Kay, Chris O'Brien
  • Publication number: 20230030749
    Abstract: Acoustic resonator devices and methods are disclosed. An acoustic resonator device includes a substrate having a front surface and a cavity. A depth of the cavity is defined by a buried oxide layer comprising etch-stop material and a perimeter of the cavity is defined by lateral fences comprising etch-stop material. A back surface of a single-crystal piezoelectric plate is attached to the front surface of the substrate except for a portion of the piezoelectric plate that forms a diaphragm that spans the cavity. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm.
    Type: Application
    Filed: April 21, 2022
    Publication date: February 2, 2023
    Inventors: Chris O'Brien, Albert Cardona
  • Patent number: 11550995
    Abstract: This application is directed to recognizing unstructured information based on hints provided by structured information. A computer system obtains unstructured information collected from a handwritten or audio source, and identifies one or more terms from the unstructured information. The one or more terms includes a first term that is ambiguous. The computer system performs a recognition operation on the first term to derive a first plurality of candidate terms for the first term, and obtains first contextual information from an information template associated with the unstructured information. In accordance with the first contextual information, the computer system selects a first answer term from the first plurality of candidate terms, such that the first term is recognized as the first answer term.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: January 10, 2023
    Assignee: EVERNOTE CORPORATION
    Inventors: Chris O'Neill, Andrew Malcolm, Alexander Pashintsev, Eugene Livshitz, Boris Gorbatov, Natalia Galaktionova, Ilya Buryak
  • Publication number: 20230006129
    Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm, the overlapping distance of the interleaved fingers defining an aperture of the resonator device. Contact pads are formed at selected locations over the surface of the substrate to provide electrical connections between the IDT and contact bumps to be attached to the contact pads. The piezoelectric plate is removed from at least a portion of the surface area of the device beneath each of the contact pads to provide lower thermal resistance between the contact bumps and the substrate.
    Type: Application
    Filed: October 21, 2021
    Publication date: January 5, 2023
    Inventors: Albert Cardona, Chris O'Brien, Greg Dyer
  • Publication number: 20230006640
    Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on the diaphragm, the overlapping distance of the interleaved fingers defining an aperture of the resonator device. Contact pads are formed at selected locations over the surface of the substrate to provide electrical connections between the IDT and contact bumps to be attached to the contact pads. The piezoelectric plate is removed from at least a portion of the surface area of the device beneath each of the contact pads to provide lower thermal resistance between the contact bumps and the substrate.
    Type: Application
    Filed: October 20, 2021
    Publication date: January 5, 2023
    Inventors: Albert Cardona, Chris O'Brien, Greg Dyer
  • Publication number: 20220393666
    Abstract: Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 8, 2022
    Inventors: Viktor Plesski, Soumya Yandrapalli, Sean McHugh, Gregory L. Hey-Shipton, Garrett Williams, Ventsislav Yantchev, Andrew Guyette, Neal Fenzi, Jesson John, Bryant Garcia, Robert B. Hammond, Patrick Turner, Douglas Jachowski, Greg Dyer, Chris O'Brien, Andrew Kay, Albert Cardona, Dylan Kelly, Wei Yang, Marie Chantal Mukandatimana, Luke Myers
  • Publication number: 20220380784
    Abstract: The invention relates to a nucleic acid comprising at least one methylation-protectable restriction element, the methylation-protectable restriction element comprising: (i) a type IIS restriction enzyme recognition sequence, or a partial type IIS restriction enzyme recognition sequence, that is recognised by a type IIS restriction enzyme that cleaves outside of the recognition sequence; (ii) a DNA methylase recognition sequence that is recognised and methylated by a DNA methylase, wherein the DNA methylase recognition sequence is identical to, or is encompassed within, the type IIS restriction recognition sequence, such that methylation of the nucleic acid by the DNA methylase methylates the type IIS restriction enzyme recognition sequence and protects the nucleic acid from cleavage by the type IIS restriction enzyme; and (iii) a recognition sequence for a sequence-specific DNA-binding protein, wherein the recognition sequence is positioned such that the binding of the sequence-specific DNA-binding protein ov
    Type: Application
    Filed: April 2, 2020
    Publication date: December 1, 2022
    Inventors: Da LIN, Katherine ROBINS, Chris O'CALLAGHAN
  • Publication number: 20220359813
    Abstract: An acoustic resonator device is formed using sacrificial polysilicon pillar by forming a polysilicon pillar on a substrate and depositing a dielectric layer to bury the polysilicon pillar and planarizing the surface of the dielectric layer. A piezoelectric plate is bonded to the planarized surface of the dielectric layer and thinned to a target piezoelectric membrane thickness. At least one conductor pattern is formed on the thinned piezoelectric plate and the polysilicon pillar is then removed using an etchant introduced through holes in the piezoelectric plate to form an air cavity where the pillar was removed.
    Type: Application
    Filed: December 3, 2021
    Publication date: November 10, 2022
    Inventors: Albert Cardona, Andrew Kay, Chris O'Brien
  • Publication number: 20220360245
    Abstract: An acoustic resonator device is formed that reduces a thermal coefficient of expansion mismatch between a piezoelectric plate and a silicon substrate by bonding the front surface of the silicon substrate having a filled and planarized sacrificial tub to a piezoelectric substrate and thinning the silicon substrate by removing material from a back surface. That back surface is then bonded to a handle wafer having a thermal coefficient of expansion (TCE) closer to a TCE of the piezoelectric substrate than a TCE of the silicon substrate and thinning the piezoelectric substrate to a target piezoelectric membrane thickness to form a piezoelectric plate. A conductor pattern is formed on the thinned piezoelectric plate and the sacrificial tub is removed to form a cavity and release a membrane of the piezoelectric plate using an etchant introduced through holes in the piezoelectric plate.
    Type: Application
    Filed: December 29, 2021
    Publication date: November 10, 2022
    Inventors: Kuan Zhang, Andrew Kay, Albert Cardona, Chris O’Brien
  • Publication number: 20220360246
    Abstract: An acoustic resonator device is formed that reduces a thermal coefficient of expansion mismatch between a piezoelectric plate and a silicon substrate by bonding the front surface of the silicon substrate having a filled and planarized sacrificial tub to a piezoelectric substrate and thinning the silicon substrate by removing material from a back surface. That back surface is then bonded to a handle wafer having a thermal coefficient of expansion (TCE) closer to a TCE of the piezoelectric substrate than a TCE of the silicon substrate and thinning the piezoelectric substrate to a target piezoelectric membrane thickness to form a piezoelectric plate. A conductor pattern is formed on the thinned piezoelectric plate and the sacrificial tub is removed to form a cavity and release a membrane of the piezoelectric plate using an etchant introduced through holes in the piezoelectric plate.
    Type: Application
    Filed: December 29, 2021
    Publication date: November 10, 2022
    Inventors: Kuan Zhang, Andrew Kay, Albert Cardona, Chris O'Brien
  • Publication number: 20220337210
    Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.
    Type: Application
    Filed: December 9, 2021
    Publication date: October 20, 2022
    Inventors: Albert Cardona, Andrew Kay, Chris O'Brien
  • Publication number: 20220337211
    Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.
    Type: Application
    Filed: December 9, 2021
    Publication date: October 20, 2022
    Inventors: Albert Cardona, Andrew Kay, Chris O'Brien
  • Publication number: 20220269852
    Abstract: Computer systems, methods, and devices for structured dynamic electronic forms are provided. The system includes a user device comprising a client form management application and a server comprising a server form management application. The client form management application generates and sends a request for a dynamic electronic form to the server. The server form management application stores the dynamic electronic form comprising separately stored form template data and form data; and merges and sends the form template data and the form data to the user device for rendering. The client form management application sends a request for a form filler package (“FFP”) comprising rules for filling out and rendering the dynamic electronic form. The server form management application sends the FFP to the user device and the client form management application renders the dynamic electronic form using the merged form template data and form data and the FFP.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 25, 2022
    Inventors: Mimi Samonte, Chris O'Connor, Kirsten Lewis, Daniel Karas, Ben Hare
  • Patent number: 11346532
    Abstract: A flashlight assembly includes a body having a head portion at one end and an opposing tapered tail portion and a clamping assembly on a bottom side of the body. The tail portion of the body tapers rearwardly towards a tail end thereof and downwardly from an upper side towards the bottom side, such that the tail end of the tail portion merges with the bottom side of the body and forms an inclined contoured surface extending from the bottom side to the top side. A contoured switch is mounted within the inclined angled surface of the tapered tail portion, and includes a safety bail pivotably movable to selectively mechanically impede operation of the switch.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: May 31, 2022
    Assignee: Emissive Energy Corp.
    Inventors: Robert D. Galli, Chris O'Brien, Kevin Okruta