Patents by Inventor Chris R. Fields

Chris R. Fields has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8957316
    Abstract: Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: February 17, 2015
    Assignee: Honeywell International Inc.
    Inventors: Chris R. Fields, Jerry Keller
  • Publication number: 20120061127
    Abstract: Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 15, 2012
    Applicant: Honeywell International Inc.
    Inventors: Chris R. Fields, Jerry Keller