Patents by Inventor Chris Rumer

Chris Rumer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallic solder thermal interface material layer and application of the same
    Patent number: 7347354
    Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: March 25, 2008
    Assignee: Intel Corporation
    Inventors: Edward Hurley, Chris Rumer, Rod Christner, Tim Renfro
  • IC package pressure release apparatus and method
    Patent number: 7242088
    Abstract: An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: July 10, 2007
    Assignee: Intel Corporation
    Inventors: Sudipto Neogi, Biswajit Sur, Boon Seng Tan, Chris Rumer
  • Windowed package for electronic circuitry
    Patent number: 7220624
    Abstract: An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: May 22, 2007
    Assignee: Intel Corporation
    Inventors: Sudipto Neogi, Biswajit Sur, Boon Seng Tan, Chris Rumer
  • Windowed package for electronic circuitry
    Publication number: 20050253254
    Abstract: An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
    Type: Application
    Filed: June 29, 2005
    Publication date: November 17, 2005
    Inventors: Sudipto Neogi, Biswajit Sur, Boon Tan, Chris Rumer
  • Metallic solder thermal interface material layer and application of the same
    Publication number: 20050211752
    Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.
    Type: Application
    Filed: March 23, 2004
    Publication date: September 29, 2005
    Inventors: Edward Hurley, Chris Rumer, Rod Christner, Tim Renfro
  • Silicon wafer with soluable protective coating
    Publication number: 20050139962
    Abstract: A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.
    Type: Application
    Filed: December 30, 2003
    Publication date: June 30, 2005
    Inventors: Ashay Dani, Gudbjorg Oskarsdottir, Chris Matayabas, Sujit Sharan, Chris Rumer, Beverly Canham
  • IC package pressure release apparatus and method
    Publication number: 20020084532
    Abstract: An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.
    Type: Application
    Filed: December 29, 2000
    Publication date: July 4, 2002
    Inventors: Sudipto Neogi, Biswajit Sur, Boon Seng Tan, Chris Rumer