Patents by Inventor Chris Simon

Chris Simon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250230311
    Abstract: A silicone-acrylic binder is made from a combination of I) a first aqueous emulsion containing a soft acrylic polymer, II) a second aqueous emulsion containing a silicone resin. The silicone-acrylic binder can be used to prepare a thermal insulation coating composition that may be applied on a metal (e.g., steel) substrate or primed substrate. A thermal insulation coating prepared by drying the thermal insulation coating composition provides the metal or primed substrate with resistance to corrosion under insulation.
    Type: Application
    Filed: April 1, 2025
    Publication date: July 17, 2025
    Inventors: Jenafer Duley, Raghida Bou Zerdan, Chris Simon, Bienvenu Ndaruhutse, Isabel Meza, Erin Vogel, Matthew Padaon, Eric Greyson, George Daisey
  • Publication number: 20230331664
    Abstract: A method for preparing a cyanoalkyl-functional silane is disclosed. The method includes removing a cyanide impurity from an olefinic nitrile before hydrosilylation of the olefinic nitrile with a hydridosilane.
    Type: Application
    Filed: August 2, 2021
    Publication date: October 19, 2023
    Inventors: Evan Bergman, Towhid Hasan, Sean Paisley, Reza Panah, Sean Reisch, Chris Simon
  • Publication number: 20050011069
    Abstract: The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board.
    Type: Application
    Filed: January 28, 2004
    Publication date: January 20, 2005
    Inventors: Deepak Pai, Chris Simon