Abstract: A retrofit lighting fixture for retrofitting a pre-existing lighting fixture. The pre-existing lighting fixture includes electrical wiring and a troffer having a recessed center portion and an outer perimeter edge, which together form a hollow inner cavity, the electrical wiring extending into the cavity. The retrofit lighting fixture includes a lighting panel, a spring and a magnet. The lighting panel has light sources and electrical wiring. The lighting panel electrical wiring is connected to the electrical wiring of the pre-existing lighting. The spring has a first end connected to the lighting panel and a second end connected to the magnet. The magnet is attached to the recessed center portion of the troffer, and the spring is configured to pull the lighting panel against the outer perimeter edge of the troffer. In some applications the retrofit lighting fixture is a LED lighting fixture.

Abstract: The present disclosure is directed to a lighting retro-fit assembly including a panel configured for the passage of light therethrough, at least one light emitting diode (LED) secured to the panel, a driver electrically connected to the at least one LED, and an extendible suspension device, where the extendible suspension device permits mechanical connection of the panel to an existing lighting structure while enabling access to the driver.

Abstract: The present disclosure is directed to a lighting retro-fit assembly including a panel configured for the passage of light therethrough, at least one light emitting diode (LED) secured to the panel, a driver electrically connected to the at least one LED, and an extendible suspension device, where the extendible suspension device permits mechanical connection of the panel to an existing lighting structure while enabling access to the driver.

Abstract: A device is provided that includes a printed circuit board having a light emitting diode. The printed circuit board is substantially planar and has a length and a width. The printed circuit board includes two first edges extending substantially the length of the printed circuit board. The device also includes a heatsink extending substantially the width and the length of the printed circuit board. The heatsink includes edges along the length of the printed circuit board, and an edge of the printed circuit board is positioned in a channel on an edge of the heatsink. The channel is crimped. A method for manufacturing a light module according to the present disclosure includes positioning a first edge of a printed circuit board in a channel on a second edge of a heatsink. The method further includes crimping the channel.

Abstract: A device is provided that includes a lens for covering a printed circuit board having a light emitting diode. The lens forms an arc in a lateral cross-section and includes two first edges at the ends of the arc. The arc spans a width of the printed circuit board and defines a space between the lens and the printed circuit board. The device also includes a heatsink adapted to couple to the printed circuit board and which extends substantially the width and the length of the printed circuit board. The heatsink includes two second edges along the length of the printed circuit board. One of the edges of the lens is positioned in a channel on one of the second edges of the heatsink, and the channel is crimped. A method is provided that includes providing a crimping a channel around a lens.

Abstract: The present disclosure is directed to a lighting retro-fit assembly including a panel configured for the passage of light therethrough, at least one light emitting diode (LED) secured to the panel, a driver electrically connected to the at least one LED, and an extendible suspension device, where the extendible suspension device permits mechanical connection of the panel to an existing lighting structure while enabling access to the driver.

Abstract: A retrofit lighting fixture for retrofitting a pre-existing lighting fixture. The pre-existing lighting fixture includes electrical wiring and a troffer having a recessed center portion and an outer perimeter edge, which together form a hollow inner cavity, the electrical wiring extending into the cavity. The retrofit lighting fixture includes a lighting panel, a spring and a magnet. The lighting panel has light sources and electrical wiring. The lighting panel electrical wiring is connected to the electrical wiring of the pre-existing lighting. The spring has a first end connected to the lighting panel and a second end connected to the magnet. The magnet is attached to the recessed center portion of the troffer, and the spring is configured to pull the lighting panel against the outer perimeter edge of the troffer. In some applications the retrofit lighting fixture is a LED lighting fixture.

Abstract: A lighting assembly includes a cooling system configured to enable the dissipation of a large amount of energy in the form of heat generated by a light source. The cooling system is configured as a gravity feed cooling loop that does not require a powered fluid pump. The light source can be a plurality of LEDs mounted on a printed circuit board (PCB). The PCB is aligned and mounted vertically onto an evaporator. The evaporator is configured to enable the vertical alignment of the PCB and to cool the PCB while in this vertical alignment. The vertical alignment of the PCB enables horizontal projection of light emitted by the LEDs, such as in an automotive headlight application.

Abstract: A lighting assembly includes a cooling system configured to enable the dissipation of a large amount of energy in the form of heat generated by a light source. Heat is dissipated without heating surrounding components, such as the one or more power supply units and device electronics. The cooling system is configured as a gravity feed system that does not require a powered fluid pump. In some embodiments, the cooling loop is configured as a thermal siphon that uses a boiling fluid to transport heat between the evaporator and the radiators. In some embodiments, the evaporator also functions as a device chassis, which reduces the overall part count. In some embodiments, the light source is a plurality of LEDs.

Abstract: Methods and devices for removing entrapped bubbles or air in photovoltaic solar cells during a manufacturing process including an encapsulation process include, for example, wiggling the photovoltaic solar cells or pushing out air bubbles by applying vibrations and/or light pressures. Optional additional steps include liquid wetting or dispensing to or around the photovoltaic solar cell matrix for air releasing before the placement of the matrix into a liquid for encapsulation.

Abstract: A lighting assembly includes a cooling system configured to enable the dissipation of a large amount of energy in the form of heat generated by a light source. The cooling system is configured as a gravity feed cooling loop that does not require a powered fluid pump. The light source can be a plurality of LEDs mounted on a printed circuit board (PCB). The PCB is aligned and mounted vertically onto an evaporator. The evaporator is configured to enable the vertical alignment of the PCB and to cool the PCB while in this vertical alignment. The vertical alignment of the PCB enables horizontal projection of light emitted by the LEDs, such as in an automotive headlight application.

Abstract: A lighting assembly includes a plurality of LEDs mounted on a flexible substrate such as a printed circuit board. The printed circuit board is bonded thermally and physically to a thicker, rigid substrate, such as a metal plate, to form a board assembly. The rigid substrate is made of a thermally conductive material, such as aluminum. As such, the board assembly provides structural rigidity and thermal conductance. Bonding the metal plate to the printed circuit board also provides improved thermal communication over the entire overlapping areas of the metal plate and printed circuit board. The board assembly is fastened to a heat exchanging device, such as an evaporator. The rigid substrate of the board assembly provides continuous contact of the substrate with the heat exchanging device in response to a reduced number of fastening points.

Abstract: A lighting assembly includes a plurality of LEDs configured as a multi-facet light engine. A first group of LEDs are arrayed as a main light source and the remaining LEDs are angled relative to the first group of LEDs to generate an intended lighting pattern. The first group of LEDs are arrayed on a first planar surface of a first substrate, and the remaining LEDs are arrayed on second planar surfaces of additional substrates positioned around the first substrate. The planar surfaces of the additional substrates are angled relative to the planar surface of the first substrate. The angles of the second planar surfaces to the first planar surface can be application specific and can be acute or obtuse.

Abstract: A lighting assembly includes a cooling system configured to enable the dissipation of a large amount of energy in the form of heat generated by a light source. Heat is dissipated without heating surrounding components, such as the one or more power supply units and device electronics. The cooling system is configured as a gravity feed system that does not require a powered fluid pump. In some embodiments, the cooling loop is configured as a thermal siphon that uses a boiling fluid to transport heat between the evaporator and the radiators. In some embodiments, the evaporator also functions as a device chassis, which reduces the overall part count. In some embodiments, the light source is a plurality of LEDs.

Abstract: In one embodiment, a method for soldering photovoltaic solar cells includes providing a first and second PV cell, a holder, soldering ribbon and a mass reflow oven. The method further includes placing the soldering ribbon in a fixture groove in the holder. The method further includes placing the first and second PV cell in the holder such that the soldering ribbon is position in a desired position on the first and second PV cell. The method further includes placing the holder and the first and second PV cell with the soldering ribbon into the mass reflow oven. The method further includes heating the holder and the first and second PV cell with the soldering ribbon in the mass reflow oven to solder the first and second PV cell. The method further includes cooling the holder and the first and second PV cell with the soldering ribbon.