Abstract: An improved method for supercritical point drying of a treated sample immersed in an intermediate drying fluid (e.g., ethanol or acetone), by purging the intermediary fluid with transitional fluid, and then entering a “stasis mode” allowing the sample to sit in its liquid state in the transitional fluid for a predetermined amount of time to extract any residual intermediary fluid into the transitional fluid. This ensures more thorough purging of the intermediary fluid from the sample and drying chamber, ultimately yielding a much higher success rate when drying thicker samples in the dryer.

Abstract: Multipurpose holders for electronic components utilized during a fabrication process must allow the components to be submerged into baths of hydrofluoric acid, rinsed in de-ionized water (D.I.), placed into baths of alcohol for dehydration, and ultimately dried prior to further processing. The holders provide both fluid flow around the wafers while in each bath of fluid and while being processed by the critical point dryer, and a containment system to keep the wafer submerged in fluid at all times during the transfer between baths and the drying equipment.

Abstract: A critical point drying apparatus for sample preparation in electron microscopy and semiconductor wafer production includes a computer system to automate the operational modes in drying the specimen. These operational modes controlled by the computer system are: cooling, in which a drying chamber is cooled; starting, in which the specimen chamber is filled with a transitional fluid; purging, in which the transitional fluid purges an intermediary fluid from the drying chamber and the purged internediary fluid is collected by a collector condenser; heating, in which the drying chamber is heated to elevate the transitional fluid to its critical point temperature and pressure; and bleeding, in which the drying chamber is depressurized to atmospheric pressure at a very slow rate until the drying chamber is completely vented, which signals the end of the drying operation. The drying chamber incorporates concave surfaces for pressure dispersal and to facilitate purging the intermediary fluid completely.

Abstract: A critical point drying apparatus for sample preparation in electron microscopy and semiconductor wafer production includes a computer system to automate the operational modes in drying the specimen. These operational modes controlled by the computer system are: cooling, in which a drying chamber is cooled; starting, in which the specimen chamber is filled with a transitional fluid; purging, in which the transitional fluid purges an intermediary fluid from the drying chamber and the purged intermediary fluid is collected by a collector condenser; heating, in which the drying chamber is heated to elevate the transitional fluid to its critical point temperature and pressure; and bleeding, in which the drying chamber is depressurized to atmospheric pressure at a very slow rate until the drying chamber is completely vented, which signals the end of the drying operation. The computer system interfaces with a remote client terminal to update the status of the operation of the critical point drying apparatus.

Abstract: A critical point drying apparatus for sample preparation in electron microscopy and semiconductor wafer production includes a computer system to automate the operational modes in drying the specimen. These operational modes controlled by the computer system are: cooling, in which a drying chamber is cooled; starting, in which the specimen chamber is filled with a transitional fluid; purging, in which the transitional fluid purges an intermediary fluid from the drying chamber and the purged intermediary fluid is collected by a collector condenser; heating, in which the drying chamber is heated to elevate the transitional fluid to its critical point temperature and pressure; and bleeding, in which the drying chamber is depressurized to atmospheric pressure at a very slow rate until the drying chamber is completely vented, which signals the end of the drying operation. The drying chamber incorporates concave surfaces for pressure dispersal and to facilitate purging the intermediary fluid completely.