Patents by Inventor Chris W. Niemi

Chris W. Niemi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898345
    Abstract: The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 13, 2024
    Assignee: CertainTeed Ceilings Corporation
    Inventors: Yanjia Zuo, Chris L. Heikkinen, John T. Madajewski, Phillip Evans, Chris W. Niemi, Jeremiah L. Shaffer, Isabelle Etchart Randlett, Robert Miller, Keith C. Hong, Zhengzhi Zhou
  • Publication number: 20210285207
    Abstract: The present disclosure relates generally to acoustic panels, for example, suitable for use in a ceiling to control sound. The present disclosure relates more particularly to an acoustic ceiling panel including an acoustic substrate formed of a porous material having an air flow resistivity of at least 300 kPa*s/m2. The acoustic substrate includes an upper face and a lower face with a pattern of perforations formed therein, where the pattern of perforations covers at least 6% of the area of the lower face. The acoustic ceiling panel also includes a backing layer disposed over the upper face of the acoustic substrate and a veil disposed over the lower face.
    Type: Application
    Filed: March 15, 2021
    Publication date: September 16, 2021
    Inventors: Yanjia Zuo, Chris L. Heikkinen, John T. Madajewski, Phillip Evans, Chris W. Niemi, Jeremiah L. Shaffer, Isabelle Etchart Randlett, Robert Miller, Keith C. Hong, Zhengzhi Zhou