Patents by Inventor Christ Heipp

Christ Heipp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor interconnect system
    Publication number: 20060081065
    Abstract: An interconnect subsystem having a sensor, at least one substrate, at least one contact assembly to said sensor and said substrate, and optionally a registration pin connected to said sensor and passing through said substrate. The contact assembly includes a guide tube, a spring within the guide tube, and a transmission tube having a contact surface and at least partially within the guide tube and forced outward by the spring, such that the contact surface contacts conductive pads on the substrate.
    Type: Application
    Filed: October 4, 2005
    Publication date: April 20, 2006
    Applicant: GVI TECHNOLOGY PARTNERS, LTD.
    Inventors: Christ Heipp, Geoffrey Cochrane