Patents by Inventor Christal J. Sumner

Christal J. Sumner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical interfaces using modular VPX technologies
    Patent number: 10236611
    Abstract: A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 19, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Carlos Peralta, Kevin M. Nakano, Christal J. Sumner, John P. Norbutas
  • ELECTRICAL INTERFACES USING MODULAR VPX TECHNOLOGIES
    Publication number: 20180145435
    Abstract: A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 24, 2018
    Inventors: Carlos Peralta, Kevin M. Nakano, Christal J. Sumner, John P. Norbutas
  • ADAPTIVE THERMAL GAP PAD
    Publication number: 20120155029
    Abstract: The present invention relates to a thermal gap pad for transferring heat from a heat-supplying component such as an electronic device, and more specifically to a thermal gap pad with reduced compressive loading. In one embodiment, a thermal assembly includes a heat-supplying component, a cooling structure, a gap pad having a first surface, and a lubricant provided along the first surface of the gap pad. The lubricant has a viscosity of about 500 cP or less. The gap pad is compressed between the heat-supplying component and the cooling structure, such that the first surface of the gap pad is in thermal contact with the cooling structure.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Applicant: RAYTHEON COMPANY
    Inventors: Tse Eric Wong, Christopher R. Koontz, Charles Chu, Christal J. Sumner