Abstract: The inventive composition contains at least one polyacrylate that can be melted and cross-linked using UV light, optional additives and is characterised by an oligomer compound comprising at least one functional group that can be cross-linked using UV, said compound having a viscosity of between 0.1 and 20 Pa·s at 25° C. The invention also relates to the use of the composition as a UV cross-linked hot-melt adhesive and to a method for producing a substrate that is provided with the composition. The composition can be used at a lower temperature than previous conventional hot-melt adhesives.