Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

Abstract: Described herein are polymer compositions useful as a semiconductive layer suitable for cables. The polymer compositions include (a) a heterophasic copolymer of propylene, (b) a polar copolymer having a polar comonomer having polar groups, (c) a solid conductive filler, and optionally (d) a polyolefin functionalised with a mono- or polycarboxylic acid compound or a derivative of a mono- or polycarboxylic acid compound, wherein said compostion is not crosslinked by the addition of a crosslinking agent. Also described herein is a process for producing the polymer compositions as well as the use of the compositions thereof.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The invention relates semiconductive polyethylene composition, for use in power cables, with improved smoothness compared to other available semiconductive polymer compositions. This invention relates to a cable with a layer comprising the semiconductive polyethylene composition.

Abstract: Described herein is a cable that includes a conductor surrounded by at least one semiconductive layer, wherein the layer comprises a polymer composition comprising a polypropylene homopolymer or a polypropylene copolymer with one or more comonomers, a polyolefin functionalized with an anhydride of a mono- or polycarboxylic acid, wherein said anhydride of a mono- or polycarboxylic acid can be linear or cyclic, wherein the functionalized polyolefin is different from the polypropylene homopolymer or polypropylene copolymer or the second polymer, and wherein the amount of the functionalized polyolefin is up to 10 wt % based on the total amount of the polymer composition, a solid conductive filler and a LDPE homopolymer or a LDPE copolymer of ethylene with one or more comonomers having a melting temperature (Tm) less than the Tm of the polypropylene homopolymer or polypropylene copolymer. Also described herein is a process for producing the polymer composition.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: The present invention relates to a semiconductive polyolefin composition comprising graphene nanoplatelets. It also relates to a semiconductive polyolefin composition comprising the combination of graphene nanoplatelets and carbon black. Moreover, the present invention is related to a process for producing the semiconductive polyolefin composition as well to the use of the semiconductive polyolefin composition in a power cable. Further, the invention is also related to an article, preferably a power cable comprising at least one semiconductive layer comprising said polyolefin composition.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

Abstract: The invention relates to a crosslinkable semiconductive polymer composition comprising (a) a polyolefin, carbon black and a compound (b), to a cable, preferably to a crosslinkable comprising the polymer composition, to a production thereof, and preferably to a crosslinked cable comprising the polymer composition of the invention.

Abstract: The present invention relates to a new polymer composition suitable for a semiconductive devices. Moreover, the present invention is related to a process for producing said composition as well as to a use of said composition. Further, the invention is also related to an article, preferably a cable, comprising said composition.

Abstract: The present invention relates to a cable comprising a novel semiconductive layer.

Abstract: Cable layer comprising a propylene polymer composition comprising (a) a polypropylene (A) (b) an elastomeric copolymer (E) comprising units derived from propylene and ethylene and/or C4 to C20 ?-olefin and (c) a polar ethylene polymer (C) wherein the cable layer and/or the propylene polymer composition has a gel content of equal or more than 0.20 wt.-%.

Abstract: The present invention relates to a semiconductive polyolefin composition comprising graphene nanoplatelets. It also relates to a semiconductive polyolefin composition comprising the combination of graphene nanoplatelets and carbon black. Moreover, the present invention is related to a process for producing the semiconductive polyolefin composition as well to the use of the semiconductive polyolefin composition in a power cable. Further, the invention is also related to an article, preferably a power cable comprising at least one semiconductive layer comprising said polyolefin composition.

Abstract: Cable layer comprising a propylene polymer composition comprising (a) a polypropylene (A) (b) an elastomeric copolymer (E) comprising units derived from propylene and ethylene and/or C4 to C20 ?-olefin and (c) a polar ethylene polymer (C) wherein the cable layer and/or the propylene polymer composition has a gel content of equal or more than 0.20 wt.-%.