Patents by Inventor Christian Altschaeffl

Christian Altschaeffl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded system and a method for adhesively bonding a hygroscopic material
    Patent number: 10332814
    Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 25, 2019
    Assignee: Infineon Technologies AG
    Inventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski
  • BONDED SYSTEM AND A METHOD FOR ADHESIVELY BONDING A HYGROSCOPIC MATERIAL
    Publication number: 20160247739
    Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.
    Type: Application
    Filed: February 18, 2016
    Publication date: August 25, 2016
    Applicant: Infineon Technologies AG
    Inventors: Claus Von Waechter, Christian Altschaeffl, Holger Doepke, Uwe Hoeckele, Franz Xaver Muehlbauer, Daniel Porwol, Tobias Schmidt, Christian Schweiger, Carsten Von Koblinski