Patents by Inventor Christian Amormino
Christian Amormino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20210327685Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.Type: ApplicationFiled: June 25, 2021Publication date: October 21, 2021Inventors: Thai Cheng Chua, Christian Amormino, Hanh Nguyen, Kallol Bera, Philip Allan Kraus
-
Patent number: 11114282Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: GrantFiled: June 8, 2020Date of Patent: September 7, 2021Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Thai Cheng Chua, Christian Amormino, Dmitry A. Dzilno
-
Patent number: 11081317Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.Type: GrantFiled: April 20, 2018Date of Patent: August 3, 2021Assignee: Applied Materials, Inc.Inventors: Thai Cheng Chua, Christian Amormino, Hanh Nguyen, Kallol Bera, Philip Allan Kraus
-
Publication number: 20200402769Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.Type: ApplicationFiled: July 6, 2020Publication date: December 24, 2020Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus
-
Publication number: 20200303167Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: ApplicationFiled: June 8, 2020Publication date: September 24, 2020Inventors: Philip Allan Kraus, Thai Cheng Chua, Christian Amormino, Dmitry A. Dzilno
-
Patent number: 10720311Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: GrantFiled: October 30, 2019Date of Patent: July 21, 2020Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Thai Cheng Chua, Christian Amormino, Dmitry A. Dzilno
-
Patent number: 10714372Abstract: The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide independent pulses of DC voltage through a switching system to electrodes disposed through the ESC substrate support, or to electrodes disposed on a surface of the ESC, or to electrodes embedded in the ESC substrate support. The switching system can independently alter the frequency and duty cycle of the pulsed DC voltage that is coupled to each electrode. During processing of the substrate, the process rate, such as etch rate or deposition rate, can be controlled independently in regions of the substrate because the process rate is a function of the frequency and duty cycle of the pulsed DC voltage. The processing uniformity of the process performed on the substrate is improved.Type: GrantFiled: September 20, 2017Date of Patent: July 14, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Thai Cheng Chua, Philip Allan Kraus, Travis Lee Koh, Christian Amormino, Jaeyong Cho
-
Patent number: 10707058Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.Type: GrantFiled: April 11, 2017Date of Patent: July 7, 2020Assignee: Applied Materials, Inc.Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus
-
Publication number: 20200066490Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Inventors: Philip Allan Kraus, Thai Cheng Chua, Christian Amormino, Dmitry A. Dzilno
-
Patent number: 10504699Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: GrantFiled: April 20, 2018Date of Patent: December 10, 2019Assignee: Applied Materials, Inc.Inventors: Philip Allan Kraus, Thai Cheng Chua, Christian Amormino, Dmitry A. Dzilno
-
Publication number: 20190326096Abstract: Embodiments described herein include a modular high-frequency emission source comprising a plurality of high-frequency emission modules and a phase controller. In an embodiment, each high-frequency emission module comprises an oscillator module, an amplification module, and an applicator. In an embodiment, each oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, each amplification module is coupled to an oscillator module, in an embodiment, each applicator is coupled to an amplification module. In an embodiment, the phase controller is communicatively coupled to each oscillator module.Type: ApplicationFiled: April 20, 2018Publication date: October 24, 2019Inventors: PHILIP ALLAN KRAUS, THAI CHENG CHUA, CHRISTIAN AMORMINO, DMITRY A. DZILNO
-
Publication number: 20190326095Abstract: Embodiments include a modular high-frequency emission source. In an embodiment, the modular high-frequency emission source includes a plurality of high-frequency emission modules, where each high-frequency emission module comprises and oscillator module, an amplification module, and an applicator. In an embodiment the oscillator module comprises a voltage control circuit and a voltage controlled oscillator. In an embodiment, the amplification module is coupled to the oscillator module. In an embodiment, the applicator is coupled to the amplification module. In an embodiment, each high-frequency emission module includes a different oscillator module.Type: ApplicationFiled: April 20, 2018Publication date: October 24, 2019Inventors: Thai Cheng CHUA, Christian AMORMINO, Hanh NGUYEN, Kallol BERA, Philip Allan KRAUS
-
Publication number: 20190088521Abstract: The present disclosure generally relates to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide independent pulses of DC voltage through a switching system to electrodes disposed through the ESC substrate support, or to electrodes disposed on a surface of the ESC, or to electrodes embedded in the ESC substrate support. The switching system can independently alter the frequency and duty cycle of the pulsed DC voltage that is coupled to each electrode. During processing of the substrate, the process rate, such as etch rate or deposition rate, can be controlled independently in regions of the substrate because the process rate is a function of the frequency and duty cycle of the pulsed DC voltage. The processing uniformity of the process performed on the substrate is improved.Type: ApplicationFiled: September 20, 2017Publication date: March 21, 2019Inventors: Thai Cheng CHUA, Philip Allan KRAUS, Travis Lee KOH, Christian AMORMINO, Jaeyong CHO
-
Publication number: 20180294143Abstract: Embodiments include a plasma processing tool that includes a processing chamber, and a plurality of modular microwave sources coupled to the processing chamber. In an embodiment, the plurality of modular microwave sources include an array of applicators that are positioned over a dielectric body that forms a portion of an outer wall of the processing chamber. The array of applicators may be coupled to the dielectric body. Additionally, the plurality of modular microwave sources may include an array of microwave amplification modules. In an embodiment, each microwave amplification module may be coupled to at least one of the applicators in the array of applicators. According to an embodiment, the dielectric body be planar, non-planar, symmetric, or non-symmetric. In yet another embodiment, the dielectric body may include a plurality of recesses. In such an embodiment, at least one applicator may be positioned in at least one of the recesses.Type: ApplicationFiled: April 11, 2017Publication date: October 11, 2018Inventors: Thai Cheng Chua, Farzad Houshmand, Christian Amormino, Philip Allan Kraus