Patents by Inventor Christian Andrada

Christian Andrada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Air cavity package with copper heat sink and ceramic window frame
    Patent number: 8013429
    Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: September 6, 2011
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Alexander Komposch, Christian Andrada
  • Air Cavity Package with Copper Heat Sink and Ceramic Window Frame
    Publication number: 20110012254
    Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 20, 2011
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammed, Julius Chew, Alexander Komposch, Christian Andrada