Abstract: A plurality of binder strips (2) are removably arranged successively one after another on a band-shaped carrier film (1), with the lengthwise direction of the binder strips arranged perpendicular to the lengthwise direction of the carrier film. Each binder strip (2) includes an adherent portion (3) having an adhesive on a bottom surface thereof, and a non-adherent portion (7) having holes punched therein suitable for being received on a ring binder or prong fastener or the like. The carrier film (1) has registration marks (6) provided thereon, so that the carrier film can be automatically advanced and sharply deflected over a release edge (14) in an apparatus, whereby the successive binder strips (2) are released from the carrier film (1) and adhered onto a page (16) of sheet goods being advanced through an adjacently located sheet folding machine.

Abstract: The process for wiring substrates with a universal pattern of conductors and a large number of predetermined bonding/cutting localities is characterized in that from the quantity of all the possibilities for bonding and cutting is removed the quantity necessary for the realization of a given application, after realization of one given circuit this quantity is tested for further possibilities for realizing the circuit, and the found quantity of possibilities is made available as a correction quantity. The advantage of such a correction potential is that layout or contacting errors can be corrected in a second passage, so that wastage is reduced.