Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: Cycloaliphatic epoxy compounds represented by general formula (I): ##STR1## wherein R.sup.1 and R.sup.2 are hydrogen atoms, or R.sup.1 and R.sup.2 taken together represent an epoxy group, R.sup.3 and R.sup.4 are the same or different and each represents a hydrogen atom or a methyl group, and Q is a linear or branched alkanediyl group with 2 to 16 carbon atoms and with the proviso that the adjacent nitrogen and oxygen atoms are not attached to the same carbon atom. The cycloaliphatic epoxy compounds can be used to produce cured epoxy resin compositions exhibiting superior mechanical properties, e.g., tensile and flexural strength and toughness.

Abstract: A composition, which comprises (a) a cycloaliphatic epoxy resin,(b) an OH-terminated polysiloxane,(c) a polysiloxane/polyether copolymer, and(d) a cyclic polysiloxane,has excellent hydrophobic properties and can be used as electric insulation composition.

Abstract: A curable epoxy resin mixture consisting ofa) 90 to 100% by weight of an aromatic glycidyl ether compound containing more than one glycidyl ether group in the molecule and 0 to 10% by weight of an epoxy resin other than aromatic polyglycidyl ethers, the sum of the epoxy resins being 100% by weight,b) 60 to 100% by weight of a polyoxyalkylenediamine or polyoxyalkylenetriamine and 0 to 40% by weight of a curing agent other than polyoxyalkyleneamines, the sum of the curing agents being 100% by weight,c) wollastonite or an inorganic filler containing more than 50% by weight of wollastonite, based on the total amount of the inorganic filler and, optionally,d) a curing accelerator, ande) glass fibres or customary additives for casting resins based on epoxy resins, is particularly suitable as casting resin composition for encapsulating, or casting in of, electrical or electronic components.