Patents by Inventor Christian Beyer

Christian Beyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12286611
    Abstract: A tissue culture vessel including a graft support tray (200) and a box having a lid (400) and a base which engages and retains the tray. The tray has two operational states: a first operational state in which a floor of the tray is slightly raised with respect to a floor of the base and a second operational state in which the floor of said tray descends to contact the floor of the base.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: April 29, 2025
    Assignee: Cutiss AG
    Inventors: Claude Nicolas Holenstein, Vincent Ronfard, Anna-Lena Dittrich, Siegfried Graf, Christian Beyer, Krzysztof Krasnopolski, Diane Ledroit, Gilles Weder, Roman Arnet, Noa Schmid, Charles Coen
  • Publication number: 20250092346
    Abstract: A tissue culture vessel including a graft support tray (200) and a box having a lid (400) and a base which engages and retains the tray. The tray has two operational states: a first operational state in which a floor of the tray is slightly raised with respect to a floor of the base and a second operational state in which the floor of said tray descends to contact the floor of the base.
    Type: Application
    Filed: December 5, 2024
    Publication date: March 20, 2025
    Inventors: Claude Nicolas Holenstein, Vincent Ronfard, Anna-Lena Dittrich, Siegfried Graf, Christian Beyer, Krzysztof Krasnopolski, Diane Ledroit, Gilles Weder, Roman Arnet, Noa Schmid, Charles Coen
  • Publication number: 20250060327
    Abstract: These disclosures relate to a computer-implemented method and related systems, programs, and modules for thermal analysis of a sample of a substance. First data representing an observable response signal of the sample when subjected to an excitation and the excitation as a function of time is provided to a first software module, where the response signal is representative of a thermal effect due to said sample. The first software module receives the first data as an input and calculates a thermoanalytical measurement curve from the first data which allows the identification of the thermal effect, and outputs second data suitable for representing said measurement curve. A second software module receives the second data as an input and outputs third data representative of the thermal effect as automatically identified from the second data by an artificial intelligence engine of the second software module.
    Type: Application
    Filed: January 9, 2023
    Publication date: February 20, 2025
    Inventors: Urs Wüst, Urs Jörimann, Matthias Höchemer, Till Schöpe, Iason Kastanis, Tommaso Bendinelli, Christian Beyer
  • Patent number: 12211702
    Abstract: A solid body is disclosed. The solid body includes: a detachment plane in an interior space of the solid body, the detachment plane including laser radiation-induced modifications; and a region including layers and/or components. A multi-component arrangement is also disclosed. The multi-component arrangement includes: a solid-body layer including more than 50% SiC and modifications or modification components generating pressure tensions in a region of a first surface, the modifications being amorphized components of the solid-body layer, the modifications being spaced closer to the first surface than to a second surface opposite the first surface, the first surface being essentially level; and a metal layer on the first surface of the solid-body layer.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 28, 2025
    Assignee: Siltectra GmbH
    Inventors: Wolfram Drescher, Marko David Swoboda, Ralf Rieske, Christian Beyer, Jan Richter
  • Patent number: 12159805
    Abstract: The present invention therefore relates to a method for separating at least one solid body layer (2) from a donor substrate (1).
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 3, 2024
    Assignee: Siltectra GmbH
    Inventors: Marko Swoboda, Ralf Rieske, Christian Beyer, Jan Richter
  • Patent number: 12151314
    Abstract: The present invention relates to a method, according to claim 1, for separating at least one solid body layer (1), particularly a solid body disk, from a donor substrate (2).
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: November 26, 2024
    Assignee: Siltectra GmbH
    Inventors: Marko Swoboda, Ralf Rieske, Christian Beyer, Jan Richter
  • Patent number: 12097641
    Abstract: A method for separating a solid-body layer from a donor substrate includes providing a donor substrate having a planar surface, a longitudinal axis orthogonal to the planar surface, and a peripheral surface, and producing modifications within the donor substrate using at least one LASER beam. The at least one LASER beam penetrates the donor substrate via the peripheral surface at an angle not equal to 90° relative to the longitudinal axis of the donor substrate. The method further includes producing a stress-inducing polymer layer on the planar surface of the donor substrate, and producing mechanical stresses in the donor substrate by a thermal treatment of the stress-inducing polymer layer. The mechanical stresses produce a crack for separating the solid-body layer, and wherein the crack propagates along the modifications.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: September 24, 2024
    Assignee: Siltectra GmbH
    Inventors: Marko David Swoboda, Christian Beyer, Franz Schilling, Jan Richter
  • Publication number: 20240263116
    Abstract: A tissue culture vessel including a graft support tray (200) and a box having a lid (400) and a base which engages and retains the tray. The tray has two operational states: a first operational state in which a floor of the tray is slightly raised with respect to a floor of the base and a second operational state in which the floor of said tray descends to contact the floor of the base.
    Type: Application
    Filed: June 20, 2022
    Publication date: August 8, 2024
    Inventors: Claude Nicolas Holenstein, Vincent Ronfard, Anna-Lena Dittrich, Siegfried Graf, Christian Beyer, Krzysztof Krasnopolski, Diane Ledroit, Gilles Weder, Roman Arnet, Noa Schmid, Charles Coen
  • Patent number: 12030216
    Abstract: A method for separating wafers from donor substrates incudes: determining at least one individual property of a respective donor substrate, the at least one individual property including doping and/or crystal lattice dislocations of the respective donor substrate; generating donor substrate process data for the respective donor substrate, the donor substrate process data including analysis data of the analysis device, the analysis data describing the at least one individual property of the respective donor substrate; generating, via a laser device, modifications inside the respective donor substrate to form a separating region inside the respective donor substrate, the laser device being operable as a function of the donor substrate process data of the respective donor substrate; and generating mechanical stresses inside the respective donor substrate to initiate and/or guide a crack for separating at least one wafer from the respective donor substrate.
    Type: Grant
    Filed: August 23, 2023
    Date of Patent: July 9, 2024
    Assignee: Siltectra GmbH
    Inventors: Marko David Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter
  • Patent number: 11996331
    Abstract: A method for separating a solid body includes: providing a first solid body having opposite first and second surfaces and a crystal lattice, and that is at least partially transparent to a laser beam emitted by a laser; modifying a portion of the crystal lattice by the laser beam, the laser beam penetrating through the first surface, the modified portion of the crystal lattice extending in a plane parallel to the first surface, as a result of the modification, subcritical cracks are formed arranged in a plane parallel to the first surface, a plurality of the subcritical cracks forming a detachment region in the first solid body, the plurality of the subcritical cracks passing at least in some sections through the modified portion of the crystal lattice; and separating the first solid body along the detachment region to form a wafer and a second solid body.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: May 28, 2024
    Assignee: Siltectra GmbH
    Inventors: Christian Beyer, Jan Richter
  • Publication number: 20240058899
    Abstract: A method for producing a detachment region in a solid-state body includes: providing a solid body that consists of a chemical compound comprising a combination of elements from the 3rd, 4th and 5th main group and subgroup 12 of the Periodic Table of the Elements; providing a laser light source; and exposing the solid body to laser beams from the laser light source. The laser beams penetrate into the solid body via a main surface of the solid body and are applied in a defined manner on a predefined portion of the solid body within the solid body to form a detachment region. The application of the laser beams successively creates multiple modifications in a crystal lattice of the solid body which, as a result of the modifications, fissures in a subcritical manner at least in a portion in each case in regions that surround the modifications.
    Type: Application
    Filed: November 1, 2023
    Publication date: February 22, 2024
    Inventors: Jan Richter, Christian Beyer, Ralf Rieske
  • Patent number: 11908652
    Abstract: A signaling device adapted to be electrically coupled to an electric potential applied to terminals of a fuse element or to clips of a fuse holder. The signaling device is adapted to signal to the outside at least one property of the fuse element. In addition, the signaling device includes at least one transmission layer having an electrically controllable transmission factor.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: February 20, 2024
    Assignee: SCHURTER AG
    Inventors: Christian Beyer, Rolf Nussbaumer, Bruno Zemp, Thomas Burch, Stephan Bitterli, Markus Beer, Cyrill Disler
  • Patent number: 11869810
    Abstract: The invention relates to a method for separating at least one solid-state layer (4) from at least one solid (1). The method according to the invention includes the steps of: producing a plurality of modifications (9) by means of laser beams in the interior of the solid (1) in order to form a separation plane (8); producing a composite structure by arranging or producing layers and/or components (150) on or above an initially exposed surface (5) of the solid (1), the exposed surface (5) being part of the solid-state layer (4) to be separated; introducing an external force into the solid (1) in order to create stresses in the solid (1), the external force being so great that the stresses cause a crack to propagate along the separation plane (8), wherein the modifications for forming the separation plane (8) are produced before the composite structure is produced.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: January 9, 2024
    Assignee: Siltectra GmbH
    Inventors: Marko Swoboda, Ralf Rieske, Christian Beyer, Jan Richter
  • Publication number: 20230390961
    Abstract: A method for separating wafers from donor substrates incudes: determining at least one individual property of a respective donor substrate, the at least one individual property including doping and/or crystal lattice dislocations of the respective donor substrate; generating donor substrate process data for the respective donor substrate, the donor substrate process data including analysis data of the analysis device, the analysis data describing the at least one individual property of the respective donor substrate; generating, via a laser device, modifications inside the respective donor substrate to form a separating region inside the respective donor substrate, the laser device being operable as a function of the donor substrate process data of the respective donor substrate; and generating mechanical stresses inside the respective donor substrate to initiate and/or guide a crack for separating at least one wafer from the respective donor substrate.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 7, 2023
    Inventors: Marko David Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter
  • Patent number: 11833617
    Abstract: The invention relates to a method for creating a detachment zone in a solid in order to detach a solid portion, especially a solid layer, from the solid, said solid portion that is to be detached being thinner than the solid from which the solid portion has been removed.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: December 5, 2023
    Assignee: Siltectra GmbH
    Inventors: Jan Richter, Christian Beyer, Ralf Rieske
  • Patent number: 11787083
    Abstract: The invention relates to a production facility (40) for detaching wafers (2) from donor substrates (4).
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: October 17, 2023
    Assignee: Siltectra GmbH
    Inventors: Marko Swoboda, Christian Beyer, Ralf Rieske, Albrecht Ullrich, Jan Richter
  • Publication number: 20230307286
    Abstract: A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.
    Type: Application
    Filed: May 26, 2023
    Publication date: September 28, 2023
    Inventors: Wolfram Drescher, Jan Richter, Christian Beyer
  • Patent number: 11699616
    Abstract: A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: July 11, 2023
    Assignee: Siltectra GmbH
    Inventors: Wolfram Drescher, Jan Richter, Christian Beyer
  • Publication number: 20230106978
    Abstract: A method for separating a solid body includes: providing a first solid body having opposite first and second surfaces and a crystal lattice, and that is at least partially transparent to a laser beam emitted by a laser; modifying a portion of the crystal lattice by the laser beam, the laser beam penetrating through the first surface, the modified portion of the crystal lattice extending in a plane parallel to the first surface, as a result of the modification, subcritical cracks are formed arranged in a plane parallel to the first surface, a plurality of the subcritical cracks forming a detachment region in the first solid body, the plurality of the subcritical cracks passing at least in some sections through the modified portion of the crystal lattice; and separating the first solid body along the detachment region to form a wafer and a second solid body.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Inventors: Christian Beyer, Jan Richter
  • Publication number: 20230005794
    Abstract: A method of splitting off a semiconductor wafer from a semiconductor bottle includes: forming a separation region within the semiconductor boule, the separation region having at least one altered physical property which increases thermo-mechanical stress within the separation region relative to the remainder of the semiconductor boule; and applying an external force to the semiconductor boule such that at least one crack propagates along the separation region and a wafer splits from the semiconductor boule.
    Type: Application
    Filed: December 9, 2020
    Publication date: January 5, 2023
    Inventors: Christian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Marko David Swoboda