Patents by Inventor Christian Bierhoff

Christian Bierhoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9309107
    Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: April 12, 2016
    Assignee: ROBERT BOSCH GMBH
    Inventors: Jochen Reinmuth, Andreas Scheurle, Christian Bierhoff
  • Patent number: 8573059
    Abstract: A capacitive micromechanical acceleration sensor has a substrate and a micromechanical functional layer situated above the substrate. A seismic mass, a suspension and fixed electrodes are situated in the micromechanical functional layer. The fixed electrodes are electrically connected to one another on a first and second side, respectively, of the suspension using buried conductor tracks. The fixed electrodes are connected to one another between the first and second side of the suspension using first and second conductors in the micromechanical functional layer.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 5, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Arnd Kaelberer, Lars Tebje, Christian Bierhoff
  • Patent number: 8530982
    Abstract: A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: September 10, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Christian Bierhoff
  • Patent number: 8443671
    Abstract: A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: May 21, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Johannes Classen, Christian Bierhoff
  • Publication number: 20120313638
    Abstract: A magnetic field sensor includes a magnetizable core having a curved surface at least sectionally, a magnetization device for magnetizing the core, and a determination device for determining a magnetic field in the core.
    Type: Application
    Filed: October 22, 2010
    Publication date: December 13, 2012
    Inventors: Christian Patak, Stefan Weiss, Frederic Njikam Njimonzie, Frank Schaltz, Paul Farber, Christian Bierhoff
  • Publication number: 20120251799
    Abstract: A micromechanical system is described having a substrate; a first micromechanical functional area, which is situated above the substrate; a second micromechanical functional area, which is situated above the first micromechanical functional area and is connected via a first weblike anchoring structure to the first micromechanical functional area; a third micromechanical functional area, which is situated above the second micromechanical functional area, and which has a first subarea and a second subarea; the first subarea being connected via a second weblike anchoring structure to the second micromechanical functional area; and the second subarea being mounted floating over the substrate by the first subarea. The invention also provides a method for manufacturing such a micromechanical system.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Inventors: Jochen REINMUTH, Andreas SCHEURLE, Christian BIERHOFF
  • Publication number: 20110197678
    Abstract: A capacitive micromechanical acceleration sensor has a substrate and a micromechanical functional layer situated above the substrate. A seismic mass, a suspension and fixed electrodes are situated in the micromechanical functional layer. The fixed electrodes are electrically connected to one another on a first and second side, respectively, of the suspension using buried conductor tracks. The fixed electrodes are connected to one another between the first and second side of the suspension using first and second conductors in the micromechanical functional layer.
    Type: Application
    Filed: August 4, 2009
    Publication date: August 18, 2011
    Inventors: Arnd Kaelberer, Lars Tebje, Christian Bierhoff
  • Publication number: 20110083506
    Abstract: A micromechanical structure includes: a substrate; a seismic mass movable relative to the substrate along a first direction parallel to a main plane of extension of the substrate; a first electrode structure is connected to the substrate; and a second electrode structure connected to the substrate. The seismic mass includes a counterelectrode structure having finger electrodes situated between first finger electrodes of the first electrode structure and second finger electrodes of the second electrode structure, along the first direction. The first electrode structure is fastened to the substrate by a first anchoring element in a central region of the micromechanical structure, and the second electrode structure is anchored to the substrate by a second anchoring element situated in the central region.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 14, 2011
    Inventors: Johannes Classen, Christian Bierhoff
  • Publication number: 20110079863
    Abstract: A micromechanical structure which includes a substrate having a main plane of extension, and a seismic mass which is movable relative to the substrate. The micromechanical structure includes a fixed electrode which is connected to the substrate, and a counterelectrode which is connected to the seismic mass. The fixed electrode has a first fixed electrode region and a second fixed electrode region which is connected in an electrically conductive manner to the first fixed electrode region. The counterelectrode is partially situated between the first and the second fixed electrode region, perpendicular to the main plane of extension.
    Type: Application
    Filed: September 21, 2010
    Publication date: April 7, 2011
    Inventors: Johannes Classen, Christian Bierhoff
  • Publication number: 20110068419
    Abstract: A micromechanical system includes a substrate, a first conductive layer situated above the substrate and a second conductive layer situated above the first conductive layer. The first conductive layer and the second conductive layer are conductively interconnected by a connecting element. The connecting element has a conductive edge surrounding a nonconductive region.
    Type: Application
    Filed: September 1, 2010
    Publication date: March 24, 2011
    Inventors: Jochen Reinmuth, Jens Frey, Christian Bierhoff