Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

Abstract: An apparatus for correcting an input signal is configured for receiving the input signal, the received input signal comprising a series of input values. The apparatus is configured for matching a series of template values to the series of input values by warping the series of template values and the series of input values relatively to each other so as to assign one or more template values to one or more input values, wherein the series of template values represents an approximation of a noise signal that is expected to be comprised in the input signal. The apparatus is configured for obtaining a series of corrected input values based on a mismatch between the input values and their respective assigned template values. The apparatus is configured for providing a corrected signal based on the series of corrected input values.

Abstract: A MEMS device includes a MEMS sound transducer, and control circuitry. The control circuitry includes a supply signal provider for providing a high-level supply signal and read-out circuitry for receiving an output signal from the MEMS sound transducer, and a switching arrangement for selectively connecting the MEMS sound transducer to the supply signal provider, and for selectively connecting the MEMS sound transducer to the read-out circuitry based on a control signal. The control circuitry provides the control signal having an ultrasonic actuation pattern to the switching arrangement during a first condition TX of the control signal, wherein the ultrasonic actuation pattern of the control signal triggers the switching arrangement for alternately coupling the high-level supply signal to the MEMS sound transducer.

Abstract: A semiconductor device has a deformable membrane, e.g., for the measurement of at least one of an acceleration, a vibration, or a pressure. The membrane has a supporting connection with a support structure which includes at least one elastic supporting connection. Also disclosed are a sensor device including the semiconductor device along with methods for manufacturing the semiconductor device and the sensor device.

Abstract: A MEMS device includes a substrate having a cavity and a membrane structure mechanically connected to the substrate and configured for deflecting out-of-plane with regard to a substrate plane and with a frequency in an ultrasonic frequency range to cause a fluid motion of the fluid in the cavity. The MEMS device includes a valve structure sandwiching the cavity together with the membrane structure, wherein the valve structure includes a planar perforated structure and a shutter structure opposing the perforated structure and arranged movably in-plane and with a frequency in the ultrasonic frequency range and with regard to the substrate plane and between a first position and a second position. The shutter structure is arranged to provide a first fluidic resistance for the fluid in the first position and a second, higher fluidic resistance for the fluid in the second position.

Abstract: A MEMS package comprises a first speaker arrangement configured for emitting sound in a first audio frequency range and a second speaker arrangement configured for emitting sound in a different second audio frequency range.

Abstract: A MEMS device and a method for operating a MEMS device are provided. The MEMS device comprises a piezoelectric transducer element having at least a first piezoelectric transducer region and a deflectable structure, wherein the deflectable structure comprises the piezoelectric transducer element. The MEMS device further comprises a control circuitry configured to readout at least a first sensor signal from the first region of the piezoelectric transducer element based on a deflection of the deflectable structure. The control circuitry is further configured to determine a control signal from the readout first sensor signal, wherein the control signal has a counteracting effect to the deflection of the deflectable structure when provided to the piezoelectric transducer element. The control circuitry is configured to provide the control signal to the piezoelectric transducer element for counteracting the deflection of the deflectable structure.

Abstract: A light steering system includes: a reflective structure configured to tilt about a first axis; a frame that includes a frame recess over which the reflective structure is suspended; and a suspension assembly that includes a piezoelectric corrugated structure coupled to and between the reflective structure and the frame. The piezoelectric corrugated structure includes a first corrugated surface including concentric rings of alternating peaks and valleys; a second corrugated surface arranged opposite to the first corrugated surface; a plurality of peak electrodes, each peak electrode being coupled to a respective peak of the first corrugated surface; a plurality of valley electrodes, each valley electrode being coupled to a respective valley of the first corrugated surface; and a common electrode layer coupled to the second corrugated surface, wherein the common electrode layer is arranged counter to the plurality of peak electrodes and to the plurality of valley electrodes.

Abstract: A piezoelectric transducer comprises a deflectable structure having a first portion and a laterally adjoining second portion. The first portion has a piezoelectric layer and the second portion has an insulating material layer, and the second portion has a higher rigidity and a smaller mass per unit area than the first portion.

Abstract: A Micro-Electro-Mechanical System (MEMS) device comprises a piezoelectric transducer having a first frequency behavior, wherein the piezoelectric transducer comprises a piezoelectric trimming region, and control circuitry to provide a bias signal to the piezoelectric trimming region of the piezoelectric transducer for adjusting a second frequency behavior of the piezoelectric transducer.

Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.

Abstract: A MEMS vibration sensor includes a piezoelectric membrane including a segmented electrode affixed to a holder; and an inertial mass affixed to the piezoelectric membrane, wherein the segmented electrode includes four segmentation zones, wherein, in an X-direction, a signal from a first segmentation zone is equal to a signal from a third segmentation zone, a signal from a second segmentation zone is equal to a signal from a fourth segmentation zone, and the signal from the first segmentation zone and the signal from the second segmentation zone have opposite signs, and wherein, in a Y-direction, a signal from the first segmentation zone is equal to the signal from the second segmentation zone, the signal from the third segmentation zone is equal to the signal from the fourth segmentation zone, and the signal from first segmentation zone and the signal from the third segmentation zone have opposite signs.

Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.

Abstract: A thermoresistive micro sensor device includes a semiconductor chip; a through hole, which runs through the semiconductor chip from an upper side to a lower side; electrically conductive structures, wherein the middle section of each of the electrically conductive structures spans over the through hole at the upper side of the semiconductor chip; an electrically insulating arrangement for electrically insulating the electrically conductive structures and the semiconductor chip from each other, wherein the through hole runs through the electrically insulating arrangement; and a contact arrangement including contacts, wherein each of the contacts is electrically connected to one of the first end sections or one of the second end sections, so that electrical energy is fed to at least one of the electrically conductive structures to heat the respective electrically conductive structure, and so that an electrical resistance of one of the electrically conductive structures is measured at the contact arrangement.

Abstract: A gas sensor comprises a membrane, a first plate arranged on a first side of the membrane and having through openings for the passage of a gas, a second plate arranged on a second side of the membrane, the second side being situated opposite the first side, and an electronic circuit, which is connected to the membrane, the first plate and the second plate and causes the membrane to emit ultrasonic radiation, and which is configured to determine a resonant frequency of the ultrasonic radiation.

Abstract: A MicroElectroMechanical Structure (MEMS) accelerometer includes a piezoelectric membrane including at least one electrode and an inertial mass, the piezoelectric membrane being affixed to a holder; and a circuit for evaluating sums and differences of signals associated with the at least one electrode to determine a three-dimensional acceleration direction, wherein the at least one electrode includes a segmented electrode, and wherein the segmented electrode includes four segmentation zones.

Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.

Abstract: An apparatus for analyzing the particulate matter content of an aerosol includes an aerosol chamber configured to receive an aerosol, the particulate matter content of which should be analyzed, at least one ultrasonic generator configured to produce ultrasonic waves in the aerosol received in the aerosol chamber, an ultrasonic detector configured to detect ultrasonic waves produced by the at least one ultrasonic generator in the aerosol, and an evaluator having a data exchange communication link with the ultrasonic detector and configured to ascertain the matter content on the basis of signals output by the ultrasonic detector. The ultrasonic generator and the ultrasonic detector are positioned relative to one another such that a path length to be traversed by ultrasonic waves between the ultrasonic generator and the ultrasonic detector is less than 1 cm.

Abstract: A photoacoustic sensor comprises an emitter for emitting electromagnetic radiation at a first wavelength and electromagnetic radiation at a second wavelength, wherein the first wavelength is for photoacoustically detecting particulate matter in a measurement cavity and the second wavelength is for photoacoustically detecting the particulate matter and at least one target gas in the measurement cavity. The photoacoustic sensor further comprises an acoustic transducer for transducing a first acoustic signal into a first sensor signal depending on an interaction of the electromagnetic radiation at the first wavelength and the particulate matter, and for transducing a second acoustic signal into a second sensor signal depending on an interaction of the electromagnetic radiation at the second wavelength with the particulate matter and the at least one target gas.

Abstract: A MEMS device includes a MEMS sound transducer, and control circuitry. The control circuitry includes a supply signal provider for providing a high-level supply signal and read-out circuitry for receiving an output signal from the MEMS sound transducer, and a switching arrangement for selectively connecting the MEMS sound transducer to the supply signal provider, and for selectively connecting the MEMS sound transducer to the read-out circuitry based on a control signal. The control circuitry provides the control signal having an ultrasonic actuation pattern to the switching arrangement during a first condition TX of the control signal, wherein the ultrasonic actuation pattern of the control signal triggers the switching arrangement for alternately coupling the high-level supply signal to the MEMS sound transducer.