Abstract: The apparatus is used for processing a microelectronic device having a face with electrically conductive elements arranged thereon. The apparatus comprises a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl. The bowl has an upper rim with an upwardly directed acute angled edge extending therealong.

Abstract: The method comprises the steps of providing a vessel for containing a solder melt, and a bowl having a horizontal upper rim with an upwardly directed edge extending therealong; immersing the bowl in the solder melt contained in the vessel; lifting the bowl to a position where at least the upper rim is located above the solder melt contained in the vessel, whereby molten solder is drawn by the bowl; dipping conductive elements of a device into the molten solder drawn by the bowl; separating the conductive elements from the molten solder drawn by the bowl; and, immediately after the separation, spinning the device about a substantially vertical axis. The spinning step comprises a first phase of submitting the device to a selected angular acceleration, a second phase, having a selected duration of spinning the device at a selected maximum rotational velocity, and a third phase submitting the device to a selected angular deceleration.