Abstract: A method for creating a pattern figure formed of pattern points, in a workpiece, using a laser device of a machining device comprises reading in first position data, which define positions of first pattern points on the workpiece, wherein the first pattern points are associated with a first portion of a polyline of the pattern figure associated with the first pattern, introduction of the first pattern points into the workpiece taking place while the machining device is located in a first position, a detection of a course of an end of the first portion of the polyline, a continuation of the course of the end of the first portion of the polyline, and an introduction of second pattern points of a second portion of the polyline into the workpiece using the continued course, while the machining device is in a second position.

Abstract: A method for controlling a laser processing process on a surface of a workpiece. The method is implementable in conjunction with a processing system. The method includes: bringing about a relative movement between the processing head and the workpiece by the second movement device in order to arrange the processing head in a first processing field of the workpiece; triggering a recording of image data of the processing field by the optical acquisition device; correcting predefined processing coordinates using correction values in order to produce corrected processing coordinates, the correction values being determined in comparison with the predefined processing coordinates using image coordinates; controlling the laser and the first movement device using the corrected processing coordinates in order to process the processing field; and bringing about a further relative movement between the processing head and the workpiece in order to arrange the processing head in a second processing field.

Abstract: A micromechanical sensor device and a corresponding production method, in which the micromechanical sensor device is equipped with a sensor substrate having a front side and a rear side, a sensor region provided on the front side that can be brought into contact with an environmental medium, and a capping device, attached on the front side, for capping the sensor region. In the capping device and/or in the sensor substrate, one or more capillaries are formed for conducting the environmental medium onto the sensor region, a liquid-repellent layer being provided at least in some regions on the inner walls of the capillaries.

Abstract: Embodiments of the invention provide a computer-implemented method for updating firmware of a Universal Serial Bus (USB) device. The USB device is configured to execute one or more applications of the USB device in a normal mode of operation of the USB device. The USB device includes a device descriptor indicative of one or more configuration descriptors, wherein a configuration descriptor is indicative of endpoints for data and command exchange. The device descriptor can be modified by adding a predefined bootloader configuration descriptor to the configurations descriptors for updating the firmware.

Abstract: A micromechanical sensor device and a corresponding production method, in which the micromechanical sensor device is equipped with a sensor substrate having a front side and a rear side, a sensor region provided on the front side that can be brought into contact with an environmental medium, and a capping device, attached on the front side, for capping the sensor region. In the capping device and/or in the sensor substrate, one or more capillaries are formed for conducting the environmental medium onto the sensor region, a liquid-repellent layer being provided at least in some regions on the inner walls of the capillaries.

Abstract: Embodiments of the invention provide a computer-implemented method for updating firmware of a Universal Serial Bus (USB) device. The USB device is configured to execute one or more applications of the USB device in a normal mode of operation of the USB device. The USB device includes a device descriptor indicative of one or more configuration descriptors, wherein a configuration descriptor is indicative of endpoints for data and command exchange. The device descriptor can be modified by adding a predefined bootloader configuration descriptor to the configurations descriptors for updating the firmware.

Abstract: A checkpointing module, a method for storing checkpoints and a microserver including a checkpointing module for storing checkpoints are proposed. The checkpointing module includes an interconnect interface configured to receive checkpoints from at least one compute module, one or more non-volatile random access memory devices configured to store the received checkpoints, a memory management entity configured to assign storage locations for the received checkpoints in the one or more non-volatile random access memory devices, and a memory controller configured to store the received checkpoints at the assigned storage locations.

Abstract: An elastomeric polymer of formula 1 is described, wherein S is a sulfur atom, P is a polymer chain that can be obtained by the anionic polymerization of at least one conjugated diene and optionally one or more vinyl aromatic compounds and that is optionally chain-end-modified, R1 is selected independently from C1-C11 alkyl, C6-C11 aryl, C7-C11 aralkyl, and C2-C11 dialkyl ether, R2 is selected independently from H, C1-C11 alkyl, C6-C11 aryl, C7-C11 aralkyl, C2-C11 dialkyl ether, and —SiR3R4R5, wherein R3, R4, and R5 are selected independently from H, C1-C16 alkyl, C6-C16aryl, and C7-C16 aralkyl, and wherein R3, R4, and R5 are selected independently from H, C6-C16 alkyl, C6-C16 aryl, and C7-C16 aralkyl, and n is an integer selected from 1-200, preferably 1 to 100, especially preferably 1 to 50, wherein the group(s) —S—R1—S—R2 is/are bonded to the backbone of the polymer chain P.

Abstract: Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely to an average plane of each of the chip packages, thereby forming a stack wherein a main surface of one of the chip packages faces a main surface of another one of the chip packages; and each of the chip packages is laterally soldered to one or more of said one or more PCBs and arranged transversally to each of said one or more PCBs, whereby an average plane of each of said one or more PCBs extends transversely to the average plane of each of the chip packages of the stack. Further embodiments are directed to related devices and fabrication methods.

Abstract: The invention relates to polymers obtainable by using novel polymerization initiator compounds and optionally chain end modifying agents. The invention further relates to a method of making the initiator compounds and the corresponding polymers, including chain end-modified polymers. The invention, also relates to polymer compositions comprising the polymer of the invention, and further components such, as extender oils, fillers, etc., and to corresponding vulcanized polymer compositions and articles comprising vulcanized parts made from, the vulcanized polymer composition.

Abstract: The invention related to novel compounds useful as modifying monomers and precursors for polymerization initiators. The invention further relates to a method of making the polymerization initiators and resulting polymers. The invention also relates to polymer compositions comprising the polymer of the invention and further components such as extender oils, fillers, vulcanizing agents etc., and to corresponding vulcanized polymer compositions and articles comprising vulcanized parts made from the vulcanized polymer composition.

Abstract: A sensor for detecting particles, in particular soot particles, includes at least two measuring electrodes and a heating element. The measuring electrodes are placed on a chip of an electrically insulating material, or on an electrically insulating intermediate layer that is on the chip. The sensor also includes a ceramic substrate upon which the heating element is configured. The chip is connected to the ceramic substrate and is made of a highly thermally conductive material.

Abstract: Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely to an average plane of each of the chip packages, thereby forming a stack wherein a main surface of one of the chip packages faces a main surface of another one of the chip packages; and each of the chip packages is laterally soldered to one or more of said one or more PCBs and arranged transversally to each of said one or more PCBs, whereby an average plane of each of said one or more PCBs extends transversely to the average plane of each of the chip packages of the stack. Further embodiments are directed to related devices and fabrication methods.

Abstract: A buck converter for converting an input voltage into an output voltage including a first switch and a low-pass filter circuit comprising an inductor, a low-pass filter switching device and an output capacitor system. The output capacitor system comprises a parallel arrangement of a first path comprising a first capacitor and at least a second path comprising a serial connection of a second capacitor and a second switch. A controller is provided to turn on the first switch during an on-cycle, thereby switching the input voltage to the low-pass filter circuit, and to turn off the first switch during an off-cycle. The controller further turns off the second switch under normal load operations so that the second capacitor is not charged and turns on the second switch in case of a load reduction during the off-cycle so that the second capacitor is added to the output capacitor system by the second switch.

Abstract: A buck converter for converting an input voltage into an output voltage including a first switch and a low-pass filter circuit comprising an inductor, a low-pass filter switching device and an output capacitor system. The output capacitor system comprises a parallel arrangement of a first path comprising a first capacitor and at least a second path comprising a serial connection of a second capacitor and a second switch. A controller is provided to turn on the first switch during an on-cycle, thereby switching the input voltage to the low-pass filter circuit, and to turn off the first switch during an off-cycle. The controller further turns off the second switch under normal load operations so that the second capacitor is not charged and turns on the second switch in case of a load reduction during the off-cycle so that the second capacitor is added to the output capacitor system by the second switch.

Abstract: The invention related to novel compounds useful as modifying monomers and precursors for polymerization initiators. The invention further relates to a method of making the polymerization initiators and resulting polymers. The invention also relates to polymer compositions comprising the polymer of the invention and further components such as extender oils, fillers, vulcanizing agents etc., and to corresponding vulcanized polymer compositions and articles comprising vulcanized parts made from the vulcanized polymer composition.

Abstract: A pressure-measuring device for recording a pressure in a combustion chamber of an internal combustion engine, having a force transmission body, situated in a housing, which is exposed to the combustion chamber and which transmits the combustion chamber pressure to a pressure-measuring unit at least indirectly by an axial motion, and having a flexible diaphragm, which is situated between the force transmission body and the housing. The flexible diaphragm is configured to be resilient to implement the axial motion of the force transmission body within the housing. A flexible additional diaphragm is connected ahead of the flexible diaphragm on the combustion chamber side, which seals the flexible diaphragm from the combustion chamber.

Abstract: Modified macromolecular compounds obtainable by using specific amino silane polymerization initiator compounds and optionally chain end-modifying compounds are described. Polymer compositions including such modified macromolecular compounds and the use of such compositions in the preparation of vulcanized (crosslinked) elastomeric polymer compositions and articles are described.

Abstract: A checkpointing module, a method for storing checkpoints and a microserver including a checkpointing module for storing checkpoints are proposed. The checkpointing module includes an interconnect interface configured to receive checkpoints from at least one compute module, one or more non-volatile random access memory devices configured to store the received checkpoints, a memory management entity configured to assign storage locations for the received checkpoints in the one or more non-volatile random access memory devices, and a memory controller configured to store the received checkpoints at the assigned storage locations.

Abstract: The invention relates to polymers obtainable by using novel polymerization initiator compounds and optionally chain end modifying agents. The invention further relates to a method of making the initiator compounds and the corresponding polymers, including chain end-modified polymers. The invention, also relates to polymer compositions comprising the polymer of the invention, and further components such, as extender oils, fillers, etc., and to corresponding vulcanized polymer compositions and articles comprising vulcanized parts made from, the vulcanized polymer composition.