Patents by Inventor Christian DiPietro

Christian DiPietro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vision-based wafer notch position measurement
    Patent number: 9831110
    Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: November 28, 2017
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Gustavo G. Francken, Brandon Senn, Peter Thaulad, Zhuozhi Chen, Richard K. Lyons, Christian DiPietro, Christopher M. Bartlett
  • VISION-BASED WAFER NOTCH POSITION MEASUREMENT
    Publication number: 20170032510
    Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.
    Type: Application
    Filed: July 30, 2015
    Publication date: February 2, 2017
    Inventors: Gustavo G. Francken, Brandon Senn, Peter Thaulad, Zhuozhi Chen, Richard K. Lyons, Christian DiPietro, Christopher M. Bartlett
  • Methods for processing wafer surfaces using thin, high velocity fluid layer
    Patent number: 7534307
    Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: May 19, 2009
    Assignee: Lam Research Corporation
    Inventors: Michael Ravkin, Michael G. R. Smith, John M. de Larios, Fritz Redeker, Mikhail Korolik, Christian DiPietro
  • Methods for Processing Wafer Surfaces Using Thin, High Velocity Fluid Layer
    Publication number: 20080230097
    Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
    Type: Application
    Filed: May 30, 2008
    Publication date: September 25, 2008
    Applicant: Lam Research Corp.
    Inventors: Michael Ravkin, Michael G.R. Smith, John M. de Larios, Fritz Redeker, Mikhail Korolik, Christian DiPietro
  • Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
    Patent number: 7383843
    Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: June 10, 2008
    Assignee: Lam Research Corporation
    Inventors: Michael Ravkin, Michael G. R. Smith, John M. de Larios, Fritz Redeker, Mikhail Korolik, Christian DiPietro
  • Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
    Publication number: 20050145265
    Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.
    Type: Application
    Filed: June 30, 2004
    Publication date: July 7, 2005
    Applicant: Lam Research Corp.
    Inventors: Michael Ravkin, Michael Smith, John de Larios, Fritz Redeker, Mikhail Korolik, Christian DiPietro
  • Belt wiper for a chemical mechanical planarization system
    Patent number: 6666755
    Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: December 23, 2003
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Christian DiPietro, Stephen Jew, Philip Ngoon, Katgenahalli Y. Ramanujam, Tony Luong