Patents by Inventor Christian Eichinger

Christian Eichinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170611
    Abstract: In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence with a bottom side, a bottom coating located on the bottom side and an electrode layer located on an underside of the bottom coating facing away from the semiconductor layer sequence, wherein the bottom coating has a thickness gradient and at least one ridge line at which the bottom coating is thickest, wherein the electrode layer extends over the at least one ridge line such that a contact side of the electrode layer facing away from the semiconductor layer sequence follows the bottom coating true to shape, and wherein an electrical and mechanical contact plane of the contact side parallel to the bottom side is defined by the at least one ridge line.
    Type: Application
    Filed: March 11, 2022
    Publication date: May 23, 2024
    Inventors: Korbinian Perzlmaier, Alexander Pfeuffer, Christian Eichinger, Andreas Leber
  • Publication number: 20220045249
    Abstract: An optoelectronic semiconductor component may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and an active zone, wherein the first semiconductor layer and the second semiconductor layer are patterned to form a mesa so that parts of the second semiconductor layer are not covered by the first semiconductor layer and a portion of the active zone is exposed in the area of a mesa flank. The optoelectronic semiconductor component may include a passivation layer arranged over parts of the first semiconductor layer and over parts of the second semiconductor layer and over the exposed portion of the active zone. The optoelectronic semiconductor component furthermore contains a first metal layer and a second metal layer. The second metal layer covers the passivation layer in the area of the mesa flank.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 10, 2022
    Inventors: Christian Eichinger, Korbinian Perzlmaier
  • Publication number: 20210336110
    Abstract: An optoelectronic semiconductor device includes a support element having a first main surface, an optoelectronic semiconductor chip which is arranged over the support element and adjacent to the first main surface, and an electrical contact element for contacting the optoelectronic semiconductor chip. The electric contact element is arranged in an opening formed in the first main surface of the support element.
    Type: Application
    Filed: September 10, 2019
    Publication date: October 28, 2021
    Inventors: Christian Eichinger, Korbinian Perzlmaier
  • Publication number: 20210273129
    Abstract: A method for producing an output coupling element and an optoelectronic component are disclosed. In an embodiment, a method includes providing an inorganic dielectric element with a surface in a chamber, wherein the inorganic dielectric element is rotatable in the chamber, providing a structuring agent comprising water and ozone and introducing the structuring agent into the chamber so that the structuring agent contacts the surface of the inorganic dielectric element thereby producing a roughening in the surface.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 2, 2021
    Inventors: Christian Eichinger, Maja Hackenberger
  • Patent number: 11024764
    Abstract: A method for producing an output coupling element and an optoelectronic component are disclosed. In an embodiment, a method includes providing an inorganic dielectric element with a surface in a chamber, wherein the inorganic dielectric element rotates in the chamber during operation and providing a structuring agent comprising water and ozone and introducing the structuring agent into the chamber so that the structuring agent contacts the surface of the inorganic dielectric element and a roughening is produced in the surface, wherein the inorganic dielectric element comprises aluminum oxide.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: June 1, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Christian Eichinger, Maja Hackenberger
  • Publication number: 20200058826
    Abstract: A method for producing an output coupling element and an optoelectronic component are disclosed. In an embodiment, a method includes providing an inorganic dielectric element with a surface in a chamber, wherein the inorganic dielectric element rotates in the chamber during operation and providing a structuring agent comprising water and ozone and introducing the structuring agent into the chamber so that the structuring agent contacts the surface of the inorganic dielectric element and a roughening is produced in the surface, wherein the inorganic dielectric element comprises aluminum oxide.
    Type: Application
    Filed: March 27, 2018
    Publication date: February 20, 2020
    Inventors: Christian Eichinger, Maja Hackenberger
  • Patent number: 10079329
    Abstract: According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: September 18, 2018
    Assignee: OSRAM OPTO Semiconductors GmbH
    Inventors: Fabian Kopp, Christian Eichinger, Korbinian Perzlmaier
  • Patent number: 10043949
    Abstract: According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: August 7, 2018
    Assignee: OSRAM OPTO Semiconductors GmbH
    Inventors: Fabian Kopp, Christian Eichinger, Korbinian Perzlmaier
  • Patent number: 9917229
    Abstract: An electrical contact structure (10) for a semiconductor component (100) is specified, comprising a transparent electrically conductive contact layer (1), on which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which completely covers the first metallic contact layer (2), and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and which separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1). Furthermore, a semiconductor component (100) comprising a contact structure (10) is specified.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: March 13, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Korbinian Perzlmaier, Bjoern Muermann, Karl Engl, Christian Eichinger
  • Patent number: 9859463
    Abstract: An optoelectronic semiconductor device has a semiconductor body including a semiconductor layer sequence with an active region that generates radiation, a semiconductor layer and a further semiconductor layer, wherein the active region is arranged between the semiconductor layer and the further semiconductor layer, a current spreading layer is arranged on a radiation exit face of the semiconductor body, the current spreading layer connects electrically conductively with a contact structure for external electrical contacting of the semiconductor layer, in a plan view of the semiconductor device the current spreading layer adjoins the semiconductor layer in a connection region, and the current spreading layer includes a patterning with a plurality of recesses through which radiation exits the semiconductor device during operation.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: January 2, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Korbinian Perzlmaier, Fabian Kopp, Christian Eichinger, Björn Muermann
  • Publication number: 20170324005
    Abstract: According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by means of a first metallic connection layer, and a reflection-enhancing dielectric layer sequence is arranged between the p-doped semiconductor layer and the first connection layer, which dielectric layer sequence includes a plurality of dielectric layers with different refractive indices.
    Type: Application
    Filed: October 20, 2015
    Publication date: November 9, 2017
    Inventors: Fabian Kopp, Christian Eichinger, Korbinian Perzlmaier
  • Publication number: 20170092808
    Abstract: An optoelectronic semiconductor device has a semiconductor body including a semiconductor layer sequence with an active region that generates radiation, a semiconductor layer and a further semiconductor layer, wherein the active region is arranged between the semiconductor layer and the further semiconductor layer, a current spreading layer is arranged on a radiation exit face of the semiconductor body, the current spreading layer connects electrically conductively with a contact structure for external electrical contacting of the semiconductor layer, in a plan view of the semiconductor device the current spreading layer adjoins the semiconductor layer in a connection region, and the current spreading layer includes a patterning with a plurality of recesses through which radiation exits the semiconductor device during operation.
    Type: Application
    Filed: May 29, 2015
    Publication date: March 30, 2017
    Inventors: Korbinian Perzlmaier, Fabian Kopp, Christian Eichinger, Björn Muermann
  • Patent number: 8710512
    Abstract: An optoelectronic semiconductor chip, comprising a first contact location (1) and a second contact location (2), and a reflective layer (3), which is directly electrically conductively connected to the second contact location. The reflective layer contains a metal that tends toward migration, and the reflective layer is arranged in such a way that a migration path (4) for the metal can form between the second and the first contact location. A means (6) which, during operation of the semiconductor chip, forms an electric field that counteracts the migration of the metal is provided at the semiconductor chip.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: April 29, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Tony Albrecht, Andreas Weimar, Anna Kasprzak-Zablocka, Christian Eichinger, Kerstin Neveling
  • Publication number: 20110079810
    Abstract: An optoelectronic semiconductor chip is specified, comprising a first contact location (1) and a second contact location (2), and a reflective layer (3), which is directly electrically conductively connected to the second contact location. The reflective layer contains a metal that tends toward migration, and the reflective layer is arranged in such a way that a migration path (4) for the metal can form between the second and the first contact location. A means (6) which, during operation of the semiconductor chip, forms an electric field that counteracts the migration of the metal is provided at the semiconductor chip.
    Type: Application
    Filed: April 24, 2009
    Publication date: April 7, 2011
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Tony Albrecht, Andreas Weimar, Anna Kasprzak-Zablocka, Christian Eichinger, Kerstin Neveling
  • Publication number: 20100055269
    Abstract: A method for producing a coconut water beverage having a pH below 4.5 by adding a food grade acid to coconut water. The method coverts coconut water from a low-acid food to a high-acid food which allows the coconut water to be subjected to less severe commercial sterilization processing and preserves the natural taste and aroma of the coconut water. The present invention is also directed to a blended beverage comprising coconut water and fruit juice and having natural isotonic properties.
    Type: Application
    Filed: August 31, 2009
    Publication date: March 4, 2010
    Applicant: Tropicana Products, Inc.
    Inventors: Kellie Haynes, Rachel Bundang, Osvaldo Chu, Christian Eichinger, D. Scott Lineback, Albert D. Bolles
  • Publication number: 20040018285
    Abstract: A method for producing a coconut water beverage having a pH below 4.5 by adding a food grade acid to coconut water. The method coverts coconut water from a low-acid food to a high-acid food which allows the coconut water to be subjected to less severe commercial sterilization processing and preserves the natural taste and aroma of the coconut water. The present invention is also directed to a blended beverage comprising coconut water and fruit juice and having natural isotonic properties.
    Type: Application
    Filed: July 23, 2002
    Publication date: January 29, 2004
    Applicant: Tropicana Products, Inc.
    Inventors: Kellie Haynes, Rachel Bundang, Osvaldo Chu, Christian Eichinger, D. Scott Lineback, Albert D. Bolles