Patents by Inventor Christian Eyholzer

Christian Eyholzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-curing epoxy resin adhesives
    Patent number: 11279796
    Abstract: A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: March 22, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Michael Gutgsell, Christian Eyholzer
  • COMPOSITE HYDROGELS
    Publication number: 20130261208
    Abstract: The present invention relates to reinforced composite hydrogel based on a polymer blend and comprising a network of fibres, said polymer blend comprising UV sensitive molecules. It also relates to a process for preparing the reinforced composite hydrogel according to the invention.
    Type: Application
    Filed: June 28, 2011
    Publication date: October 3, 2013
    Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
    Inventors: Ana Carolina Borges De Couraca, Pierre-Etienne Bourban, Jan-Anders Edvin Manson, Dominique Pioletti, Arne Vogel, Christian Eyholzer, Philippe Tingaut, Tanja Zimmermann