Abstract: This invention relates to heat-shrinkable devices for forming solder connections between two bodies such as electrical conductors or pipes. The devices each comprise a hollow, heat-shrinkable sleeve having at least one aperture and containing first and second solder inserts. The solder inserts are located adjacent to each other and the second insert responds to heat applied to the device more slowly than the first insert. Usually the second insert has a higher melting point than the first insert. When the device is installed the first solder insert melts but is prevented from flowing out of the aperture in the device by the second insert. Also flow of the fused first solder insert onto the second solder insert causes the second insert to melt with less heat being applied to the device than would be needed if only the second, higher melting point solder insert were present in the device.

Abstract: This invention relates to heat-shrinkable devices for forming solder connections between electrical conductors. The devices each comprise of a hollow, heat-shrinkable sleeve having first and second ends, and contain a quantity of solder. Both ends contain heat-softenable sealing material which seal the ends upon recovery of the article, the sealing material at the second end being less responsive to heat than the sealing material at the first end. The conductors to be connected are inserted into the first end of the sleeve and the sleeve recovered. Because the sealing material at the second end does not seal the second end until after the sealing material at the first end has recovered about the inserted conductors at the first end, any hot gases evolved within the article can exit the article via the second end. The invention enables a reliable connection to be made between electrical conductors that are provided with heat-sensitive insulation.