Abstract: A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which are respectively patterned and thus form conductor tracks, and an insulating layer disposed between the two conductive layers. The first conductive layer has first contacts, formed as spot-welded joints, for power connecting areas of power semiconductor components, second contacts for control connecting areas of power semiconductor components and third contacts for the load connection to a printed circuit board. The second conductive layer connects to the first conductive layer and fourth contacts for providing control connection to an external printed circuit board. The film composite also has film sections between the first and second contacts and between the third and fourth contacts, which are arranged in guide sections of the housing.

Abstract: A power semiconductor substrate comprising an insulating planar base, at least one conductor track and at least one contact area as part of the conductor track, wherein a layer of a metallic material is disposed on the contact area by means of pressure sintering. The associated method comprises the steps of: producing a power semiconductor substrate that includes a planar insulating base, conductor tracks and contact areas; arranging a pasty layer, composed of a metallic material and a solvent, on at least one contact area of the power semiconductor substrate; and applying pressure to the pasty layer.

Abstract: A power semiconductor substrate with an insulating sheet-like base, having at least one sequence of layers of: a thin adhesion promoting layer, a sintered metal layer and a conductive layer arranged on at least one main area of the substrate. The associated process includes the steps of: coating at least a portion of the one main area with the adhesion promoting layer; arranging a pasty layer of the sintered metal and a solvent on at least a portion of the adhesion promoting layer; arranging the conductive layer on the sintered metal layer; and applying pressure to the conductive layer of the power substrate.

Abstract: A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite sides of the insulating film. The film composite is formed as a layer construction of a conductive film alternating with an insulating film, wherein at least one conductive film is structured and thus forms conductor tracks. Furthermore, at least one conductive film of a main area of the film composite is made of a first metal and has at least one film section having a layer of a second metal that is thinner in comparison with the thickness of the first layer.

Abstract: A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which are respectively patterned and thus form conductor tracks, and an insulating layer disposed between the two conductive layers. The first conductive layer has first contacts, formed as spot-welded joints, for power connecting areas of power semiconductor components, second contacts for control connecting areas of power semiconductor components and third contacts for the load connection to a printed circuit board. The second conductive layer connects to the first conductive layer and fourth contacts for providing control connection to an external printed circuit board. The film composite also has film sections between the first and second contacts and between the third and fourth contacts, which are arranged in guide sections of the housing.

Abstract: An apparatus and a clocked method for pressure-sintered bonding of a plurality of chiplike components to conductor tracks on a substrate. The apparatus has a pressing device, a conveyor belt, and a further device for covering the substrate with a protective film. The pressing device is suitable for clocked operation and has a pressing die with a silicone pressure cushion and a heatable pressing table. The conveyor belt is pressure-stable and extends directly above the pressing table. The protective film is disposed between the substrate, with the components disposed thereon, and the pressing die. During the clocked method, the top side of the substrate is covered with the protective film, and then the pressure-sintering operation is started by pressing the pressure cushion onto the top side of the substrate.

Abstract: A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with power semiconductor components disposed on the conductor tracks. Also disposed on the conductor tracks are spacer elements and a foil composite that includes two metal foil layers with an electrically insulating foil layer disposed between them. The foil composite has contact humps and plated-through holes. At least one of the metal foil layers is structured in a manner to suit the circuitry with which the module is used, and this foil composite is durably connected to the power semiconductor components and to the spacer elements, preferably by ultrasonic welding.

Abstract: A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimensionally stable and effects pressure-contact between the printed circuit board and the connection leads. On its primary face facing the printed circuit board, the pressure piece has a plurality of pressure elements that space the primary face from the printed circuit board. In a preferred embodiment at least one rib includes a notch. Preferably, the pressure piece has at least one opening connecting its two primary faces permitting fluid flow between the edge of the pressure element and the notch.

Abstract: A method for internal electrical insulation of a substrate for a power semiconductor module having a framelike insulating housing with a cap and having an insulating substrate. The substrate has conductor tracks and power semiconductor components mounted thereon. The power semiconductor components are connected to connection elements, e.g., further conductor tracks or power semiconductor components, by means of bond connections. The method is characterized by the following steps: a) forming the substrate; b) coating the substrate with a viscous dielectric insulation compound in a casting process or immersion process; c) initiating the cross-linking of the insulation compound; d) with the substrate in a suspended position, permitting excess insulation compound to drip off, and securely enveloping the bond connections with insulation compound; and e) placing the substrate in the housing.

Abstract: A power semiconductor module and a method for producing it, wherein the module includes a substrate, with conductor tracks disposed on it to suit circuitry with which the module is used and with power semiconductor components disposed on the conductor tracks. Also disposed on the conductor tracks are spacer elements and a foil composite that includes two metal foil layers with an electrically insulating foil layer disposed between them. The foil composite has contact humps and plated-through holes. At least one of the metal foil layers is structured in a manner to suit the circuitry with which the module is used, and this foil composite is durably connected to the power semiconductor components and to the spacer elements, preferably by ultrasonic welding.

Abstract: A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimensionally stable and effects pressure-contact between the printed circuit board and the connection leads. On its primary face facing the printed circuit board, the pressure piece has a plurality of pressure elements that space the primary face from the printed circuit board. In a preferred embodiment at least one rib includes a notch. Preferably, the pressure piece has at least one opening connecting its two primary faces permitting fluid flow between the edge of the pressure element and the notch.

Abstract: A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements.

Abstract: A circuit arrangement includes a base body, with one or more substrates, an intermediate-circuit board, a compression device and a driver circuit. Each substrate includes a positive-pole conductive strip, a negative-pole conductive strip, and auxiliary connections. Components such as power transistors, are in contact with the conductive strips and the auxiliary connections. The intermediate-circuit board includes a positive-pole DC connection and negative-pole DC connection and electrical capacitors connected between them. An AC connection element that must be cooled is assigned to each substrate. The positive-pole DC connection and the negative-pole DC connection include contacts for direct low-inductance connection with the corresponding conductive strips of the one or more substrates. The equivalent applies to the one or more AC connection elements.

Abstract: An electronic circuit mounting arrangement includes heat-conducting, electrically insulating and/or conducting pastes (14, 30) as well as flexible conductor plates (16, 28). The utilization and application of these elements make it possible to increase the packing density of the components (22, 32) also in the field of the high-power circuit arrangements. It further provides for a substantial rationalization in the connection technique for an optimization in the means of the contacting procedure. The economic manufacturing, accompanied by a destruction-free partial demountability, permits based on the use of pastes and foils the further mounting of electronic circuit arrangements resulting in an increased circuit density in one circuit unit.