Abstract: Disclosed are chip module structures, each having a robust in-package interconnect for reliable performance. Some of the chip module structures achieve interconnect robustness through the use of vias in a spiral step pattern within the interconnect itself. Some chip module structures achieve interconnect robustness through the use of an interconnect stabilizer (referred to herein as a stabilization structure, fence or cage)), which includes vias in a repeating step pattern encircling the in-package interconnect, which is electrically isolated from back side solder balls, front side collapse chip connections (referred to herein as C4 connections), and the interconnect itself, and which is optionally connected to ground. Some chip module structures achieve interconnect robustness through the use of a combination of both vias in a spiral step pattern within the interconnect itself and an interconnect stabilizer.

Abstract: The invention relates to a computer-implemented method comprising the steps of: (S100) presenting a surface (S) comprising segments derived from volumetric data (VD) in a virtual reality user interface (6); (S200) presenting volumetric data (VD) in the virtual reality user interface (6); (S300) applying a signed distance field technique (SDF) to the segments in reference to the presented volumetric data (VD); (S400) adjusting at least one of the segments based on a result of applying the signed distance field technique (SDF) so that the presented surface data complies with the presented volumetric data (VD); and (S500) saving the adjusted at least one of the segments in a data file (DF) separately from a data file of the volumetric data (VD).

Abstract: Disclosed are chip module structures, each having a robust in-package interconnect for reliable performance. Some of the chip module structures achieve interconnect robustness through the use of vias in a spiral step pattern within the interconnect itself. Some chip module structures achieve interconnect robustness through the use of an interconnect stabilizer (referred to herein as a stabilization structure, fence or cage)), which includes vias in a repeating step pattern encircling the in-package interconnect, which is electrically isolated from back side solder balls, front side collapse chip connections (referred to herein as C4 connections), and the interconnect itself, and which is optionally connected to ground. Some chip module structures achieve interconnect robustness through the use of a combination of both vias in a spiral step pattern within the interconnect itself and an interconnect stabilizer.

Abstract: The balloon includes a pouch formed of a sealed wall delimiting an internal space, and a valve for filling the internal space with a fluid, capable of being occluded after filling the internal space. The pouch delimits a fluid-draining orifice opening into the internal space. The balloon further includes an occluding ball that occludes the draining orifice. The occluding ball can be spherical or polyhedral, and be capable of releasing the draining orifice under the effect of a magnetic field, so as to enable the at least partial drainage of the fluid contained in the internal space. The occluding ball is movable along at least two distinct axes in relation to the pouch.

Abstract: The present disclosure relates to a measuring device with a bipolar electrode array for the impedimetric analysis of adherent cells according to the ECIS principle (electric cells substrate impedance sensing). The measuring device comprises an electrode array which is adapted for being wetted with an electrolyte solution and adherently growing cells in order to perform impedimetric cell analyzes, characterized in that the electrode array comprises a bipolar electrode on a substrate, where the bipolar electrode is formed as a conductive path on the transparent substrate and has an inherent resistance between two connection points of the conductive path that is a multiple of the AC impedance of the electrolyte solution at 1 MHz, measured at the two connection points.

Abstract: The invention relates to a computer-implemented method comprising the steps of: (S100) presenting a surface (S) comprising segments derived from volumetric data (VD) in a virtual reality user interface (6); (S200) presenting volumetric data (VD) in the virtual reality user interface (6); (S300) applying a signed distance field technique (SDF) to the segments in reference to the presented volumetric data (VD); (S400) adjusting at least one of the segments based on a result of applying the signed distance field technique (SDF) so that the presented surface data complies with the presented volumetric data (VD); and (S500) saving the adjusted at least one of the segments in a data file (DF) separately from a data file of the volumetric data (VD).

Abstract: RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.

Abstract: RF semiconductor chips may be packaged on wafer level on the basis of a two-step process for providing a package material, thereby providing very short electrical connections between antenna structures formed in the package material and the semiconductor chip. In some illustrative embodiments, the antenna structures may be provided above the semiconductor chip, which results in a very space-efficient overall configuration.

Abstract: The balloon includes a pouch formed of a sealed wall delimiting an internal space, and a valve for filling the internal space with a fluid, capable of being occluded after filling the internal space. The pouch delimits a fluid-draining orifice opening into the internal space. The balloon further includes an occluding ball that occludes the draining orifice. The occluding ball can be spherical or polyhedral, and be capable of releasing the draining orifice under the effect of a magnetic field, so as to enable the at least partial drainage of the fluid contained in the internal space. The occluding ball is movable along at least two distinct axes in relation to the pouch.

Abstract: An induction hob has a hob plate, a plurality of induction heating coils which are arranged below the hob plate, and a plurality of sensor coils which are arranged below the hob plate and above the induction heating coils, and also temperature sensors. The sensor coils and the temperature sensors are arranged on a flexible support and electrical conductors make electrical contact with the sensor coils on the flexible support. The flexible support has a single common connection device for electrical contact to be made.

Abstract: The present disclosure relates to a measuring device with a bipolar electrode array for the impedimetric analysis of adherent cells according to the ECIS principle (electric cells substrate impedance sensing). The measuring device comprises an electrode array which is adapted for being wetted with an electrolyte solution and adherently growing cells in order to perform impedimetric cell analyzes, characterized in that the electrode array comprises a bipolar electrode on a substrate, where the bipolar electrode is formed as a conductive path on the transparent substrate and has an inherent resistance between two connection points of the conductive path that is a multiple of the AC impedance of the electrolyte solution at 1 MHz, measured at the two connection points.

Abstract: A method is provided for introducing an opening on at least one component (B) of fiber composite material. The method includes introducing an opening (7) into the component (B) placed in a mold (1; 20). A form (4; 27) then is fashioned in the same mold (1; 20) in the vicinity of the opening. The method then includes filling a vicinity of the opening with plastic. The plastic forms a surround (5, 26) around the peripheral region of the component (B) that forms the opening (7).

Abstract: The present invention relates to a specific process for producing trisilylamine from monochlorosilane and ammonia in the liquid phase. The invention further relates to a plant in which such a process can be carried out with advantage.

Abstract: The invention relates to a process for producing trimeric and/or quaternary silicon compounds or trimeric and/or quaternary germanium compounds, where a mixture of silicon compounds or a mixture of germanium compounds is exposed to a nonthermal plasma, and the resulting phase is subjected at least once to a vacuum rectification and filtration.

Abstract: The present invention relates to a specific process for producing trisilylamine from monochlorosilane and ammonia in the liquid phase. The invention further relates to a plant wherein such a process can be carried out with advantage.

Abstract: An induction hob has a hob plate, a plurality of induction heating coils which are arranged below the hob plate, and a plurality of sensor coils which are arranged below the hob plate and above the induction heating coils, and also temperature sensors. The sensor coils and the temperature sensors are arranged on a flexible support and electrical conductors make electrical contact with the sensor coils on the flexible support. The flexible support has a single common connection device for electrical contact to be made.

Abstract: The invention relates to a process for preparing trisilylamine and polysilazanes in the liquid phase, in which ammonia is introduced in a superstoichiometric amount relative to 5 monochlorosilane which is present in an inert solvent. Here, a reaction in which trisilylamine and polysilazanes are formed proceeds. TSA is subsequently separated off in gaseous form from the product mixture. The TSA obtained is purified by filtration and distillation and obtained in high or very high purity. The bottom product mixture is conveyed from the reactor through a filter unit in which solid ammonium chloride is separated off to give a liquid mixture of polysilazanes and solvent. This is fed to a further distillation to recover solvent. As a result of the NH3 being introduced in a superstoichiometric amount relative to monochlorosilane, monochlorosilane is completely reacted in the reactor.

Abstract: The present invention relates to a specific process for producing trisilylamine from monochlorosilane and ammonia in the liquid phase. The invention further relates to a plant wherein such a process can be carried out with advantage.

Abstract: A process for producing trisilylamine in the liquid phase by charging monochlorosilane in the liquid state in a solvent at elevated temperature, and reacting the monochlorosilane with NH3 in a stoichiometric excess is provided. Additionally provided is a production unit for carrying out the process.

Abstract: The present invention relates to a specific process for producing trisilylamine from monochlorosilane and ammonia in the liquid phase. The invention further relates to a plant wherein such a process can be carried out with advantage.