Patents by Inventor Christian Hagen

Christian Hagen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7566968
    Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: July 28, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Michael Bauer, Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner
  • Patent number: 7554196
    Abstract: A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: June 30, 2009
    Assignee: Infineon Technologies AG
    Inventors: Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen
  • Patent number: 7524699
    Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: April 28, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Patent number: 7517722
    Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: April 14, 2009
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger W├Ârner
  • Patent number: 7508083
    Abstract: The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.
    Type: Grant
    Filed: March 9, 2004
    Date of Patent: March 24, 2009
    Assignee: Infineon Technologies AG
    Inventors: Robert-Christian Hagen, Simon Jerebic
  • Publication number: 20090051017
    Abstract: An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.
    Type: Application
    Filed: September 4, 2008
    Publication date: February 26, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Beng Tatt Wee, Fuaida Harun, Soon Hock Tong, Robert-Christian Hagen, Yang Hong Heng, Kean Cheong Lee
  • Publication number: 20080284043
    Abstract: A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.
    Type: Application
    Filed: February 23, 2005
    Publication date: November 20, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Robert-Christian Hagen, Jens Pohl
  • Patent number: 7391103
    Abstract: The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.
    Type: Grant
    Filed: August 27, 2004
    Date of Patent: June 24, 2008
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Holger Woerner, Peter Strobel
  • Patent number: 7327023
    Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: February 5, 2008
    Assignee: Infineon Technologies AG
    Inventors: Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Peter Strobel, Hermann Vilsmeier, Holger Woerner, Bernhard Zuhr
  • Publication number: 20070278639
    Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.
    Type: Application
    Filed: July 21, 2005
    Publication date: December 6, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Ulrich Bachmaier, Robert-Christian Hagen, Jens Pohl, Rainer Steiner, Hermann Vilsmeier, Holger Woerner, Bernhard Zuhr
  • Patent number: 7276783
    Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 2, 2007
    Assignee: Infineon Technologies AG
    Inventors: Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner
  • Publication number: 20070128754
    Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.
    Type: Application
    Filed: June 4, 2004
    Publication date: June 7, 2007
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Patent number: 7190059
    Abstract: The invention relates to a method for producing an electronic component, a stack of semiconductor chips, and an electronic component including a stack of semiconductor chips. The stack has at least a lower electronic module connected via flipchip connections to a central area of a rewiring substrate. The stack also has at least an upper electronic module with external contact surfaces connected via bonding connections to outer areas of the rewiring substrate.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: March 13, 2007
    Assignee: Infineon Technologies AG
    Inventors: Robert-Christian Hagen, Holger Woerner
  • Publication number: 20060258046
    Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.
    Type: Application
    Filed: July 24, 2006
    Publication date: November 16, 2006
    Inventors: Bernd Goller, Robert-Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Worner
  • Publication number: 20060255478
    Abstract: The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides are embedded in a plastic molding compound. The lateral sides and/or the rear side of the semiconductor chip have an anchoring region, by means of which the semiconductor chip is in positive engagement with the surrounding plastic molding compound. The invention also relates to a method for producing the component.
    Type: Application
    Filed: March 9, 2004
    Publication date: November 16, 2006
    Inventors: Robert-Christian Hagen, Simon Jerebic, Robert Hagen
  • Publication number: 20060183306
    Abstract: An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.
    Type: Application
    Filed: March 23, 2006
    Publication date: August 17, 2006
    Inventors: Robert-Christian Hagen, Gerald Ofner
  • Publication number: 20060175419
    Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 10, 2006
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Publication number: 20060125042
    Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.
    Type: Application
    Filed: July 8, 2004
    Publication date: June 15, 2006
    Inventors: Edward Fuergut, Bernd Goller, Robert-Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner
  • Patent number: 7045881
    Abstract: An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.
    Type: Grant
    Filed: November 19, 2001
    Date of Patent: May 16, 2006
    Assignee: Infineon Technologies AG
    Inventors: Robert-Christian Hagen, Gerald Ofner
  • Publication number: 20060091522
    Abstract: A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.
    Type: Application
    Filed: October 11, 2005
    Publication date: May 4, 2006
    Inventors: Ulrich Bachmaier, Michael Bauer, Robert-Christian Hagen