Abstract: A filter arrangement may include a filter element and a gasket element. The gasket element may include a substantially circular flow-through opening and a locking collar. The locking collar may be arranged along a circumference of the flow-through opening with respect to a circumferential direction. The locking collar may form a hollow cylindrical installation space. The filter element may include a filter element body and a substantially hollow-cylindrical counter locking collar. The counter locking collar may include an open axial side and a covered axial side which may be spaced apart from each other with respect to an axial axis. The covered axial side of the counter locking collar may be covered by said filter element body. The counter locking collar may be at least partially inserted into the hollow cylindrical installation space of the locking collar.

Abstract: A filter arrangement may include a filter element and a gasket element. The gasket element may include a substantially circular flow-through opening and a locking collar. The locking collar may be arranged along a circumference of the flow-through opening with respect to a circumferential direction. The locking collar may form a hollow cylindrical installation space. The filter element may include a filter element body and a substantially hollow-cylindrical counter locking collar. The counter locking collar may include an open axial side and a covered axial side which may be spaced apart from each other with respect to an axial axis. The covered axial side of the counter locking collar may be covered by said filter element body. The counter locking collar may be at least partially inserted into the hollow cylindrical installation space of the locking collar.

Abstract: A Peltier element for a thermoelectric heat exchanger may include n-doped n-type semiconductors, p-doped p-type semiconductors, and a plate structure for electrically contacting the semiconductors. The plate structure may include first plate sections and second plate sections, which may be alternately arranged along an extension of the Peltier element. The first plate sections may form a first side of the Peltier element, and the second plate sections may form a second side of the Peltier element, the second side being spaced from the first side. The plate structure may further include a plurality of legs. Each leg may interconnect adjacent first and second plate sections and may extend inclined relative to the adjacent first and second plate sections. An n-type semiconductor and a p-type semiconductor may be alternately integrated in the legs along the plate structure.

Abstract: A heat exchanger may include a flow chamber able to be flowed through by a first fluid, a fin structure arranged in the flow chamber, a heat transfer chamber, and a thermoelectric temperature-control system. The temperature-control system may include at least one Peltier element with a plurality of p-doped p-type semiconductors and a plurality of n-doped n-type semiconductors electrically contacting one another. On a side of the fin structure, a plurality of connecting structures may be arranged. A respective connecting structure may include an electrically insulating base layer and an electrically conductive connecting layer. The fin structure may include the base layer. The connecting layer may be applied on a side of the base layer facing away from the fin structure. One such p-type semiconductor and one such n-type semiconductor may be mounted on the connecting layer. The fin structure may be provided with the base layer via oxidation.

Abstract: A method for producing a Peltier element of a heat exchanger for temperature control of a fluid flowable through a flow chamber may include providing an electrically conductive belt. The method may also include providing the belt with a plurality of p-doped P-semiconductors and a plurality of n-doped N-semiconductors so as to alternate with one another along the belt. The plurality of p-doped P-semiconductors and the plurality of n-doped N-semiconductors respectively may have a side facing away from the flow chamber electrically contacted by a contacting structure that may include a plurality of contact elements. The method may also include separating the belt to produce a plurality of connecting elements of a connecting structure electrically contacting a side of the plurality of p-doped P-semiconductors and the plurality of n-doped N-semiconductors facing towards the flow chamber, respectively.

Abstract: A heat exchanger for heating a vehicle interior may include a heat exchanger block including a plurality of air ducts and a plurality of coolant ducts arranged according to a cross flow principle. The heat exchanger block may have a first heat exchanger stage including an air inlet side and a second heat exchanger stage including an air outlet side. The plurality of air ducts and the plurality of coolant ducts may extend through the heat exchanger block and may be coupled to one another in a heat-transferring and media-separated manner in both the first heat exchanger stage and the second heat exchanger stage. The heat exchanger may further include a plurality of thermoelectric modules, configured to operate as a heat pump to transfer heat from the coolant flow to the air flow, arranged between the plurality of air ducts and the plurality of coolant ducts.

Abstract: A Peltier element for a thermoelectric heat exchanger may include n-doped n-type semiconductors, p-doped p-type semiconductors, and a plate structure for electrically contacting the semiconductors. The plate structure may include first plate sections and second plate sections, which may be alternately arranged along an extension of the Peltier element. The first plate sections may form a first side of the Peltier element, and the second plate sections may form a second side of the Peltier element, the second side being spaced from the first side. The plate structure may further include a plurality of legs. Each leg may interconnect adjacent first and second plate sections and may extend inclined relative to the adjacent first and second plate sections. An n-type semiconductor and a p-type semiconductor may be alternately integrated in the legs along the plate structure.

Abstract: A method for producing an electric and mechanically serial arrangement in a thermoelectric heat exchanger for temperature-controlling a fluid may include providing an electrically conductive strip. The method may also include providing the strip with a Peltier element including a plurality of p-doped p-semiconductors and a plurality of n-doped n-semiconductors so as to alternate with one another along the strip. Providing the strip with the Peltier element may include electrically contacting the plurality of p-doped p-semiconductors and the plurality of n-doped n-semiconductors by a connecting structure including a plurality of connecting elements.

Abstract: A method for producing a Peltier element of a heat exchanger for temperature control of a fluid flowable through a flow chamber may include providing an electrically conductive belt. The method may also include providing the belt with a plurality of p-doped P-semiconductors and a plurality of n-doped N-semiconductors so as to alternate with one another along the belt. The plurality of p-doped P-semiconductors and the plurality of n-doped N-semiconductors respectively may have a side facing away from the flow chamber electrically contacted by a contacting structure that may include a plurality of contact elements. The method may also include separating the belt to produce a plurality of connecting elements of a connecting structure electrically contacting a side of the plurality of p-doped P-semiconductors and the plurality of n-doped N-semiconductors facing towards the flow chamber, respectively.

Abstract: A thermoelectric arrangement for use in a cooling system (4, 6) of a motor vehicle has a thermocouple (8) with a first, heat-outputting thermal element (10), a second, heat-absorbing thermal element (12) and a conductor element (14) through which current flows. At least two cooling circuits (16, 18, 20) are provided. The first thermal element (10) is arranged in at least one cooling circuit (16, 18, 20), and the second thermal element (12) is arranged in at least one heating circuit (48). The first thermal element (10) is arranged in a first connecting line (22) that is connected fluidically to the respective cooling circuits (16, 18, 20) via valve arrangements (24, 26; 28, 30; 32, 34) on the input and output sides of the first thermal element (10). A cooling system having such a thermoelectric arrangement also is described.

Abstract: A thermoelectric arrangement for use in a cooling system (4, 6) of a motor vehicle has a thermocouple (8) with a first, heat-outputting thermal element (10), a second, heat-absorbing thermal element (12) and a conductor element (14) through which current flows. At least two cooling circuits (16, 18, 20) are provided. The first thermal element (10) is arranged in at least one cooling circuit (16, 18, 20), and the second thermal element (12) is arranged in at least one heating circuit (48). The first thermal element (10) is arranged in a first connecting line (22) that is connected fluidically to the respective cooling circuits (16, 18, 20) via valve arrangements (24, 26; 28, 30; 32, 34) on the input and output sides of the first thermal element (10). A cooling system having such a thermoelectric arrangement also is described.