Patents by Inventor Christian Janisch

Christian Janisch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160095465
    Abstract: The present invention presents a pumping system (1) with a preheated reservoir (2), a main pump (4) for pumping a preheated liquid (3) from the reservoir (2), and pressurizing means (5) for pressurizing the reservoir (2). Preferably, the pressurizing means set an absolute pressure of 0.5 to 1 bar in the reservoir (2). The liquid (3) in the reservoir (2) can be heated up to 90° C. or more. The present invention achieves a nearly complete suppression of the phenomenon of cavitation at the main pump entrance, and thus achieves an increased pumping performance at elevated liquid temperatures.
    Type: Application
    Filed: May 21, 2014
    Publication date: April 7, 2016
    Inventors: Youcef Ait Bouziad, Christian Janisch, Alfred Yoakim, Renzo Moser
  • Patent number: 7885080
    Abstract: A system component of a control device, especially for a transmission or engine controller of a motor vehicle, is provided as a closed system component for a control device which can be transported, thereby allowing decentralized manufacturing of the system component. The system component has a hybrid circuit, equipped with electronic components, which is embedded in a printed circuit board, recessed in the center, in such a manner that the hybrid circuit is completely enclosed by the printed circuit board. The hybrid circuit and the printed circuit board are mounted on a base element and connected to each other via contact elements. A cover element is positioned on top of the hybrid circuit and the contact elements in such a manner that the hybrid circuit is fully encapsulated by the base element, the cover element and the printed circuit board from environmental influences.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: February 8, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Christian Janisch, Johannes Mehler, Walther Seiwerth, Peter Stetter, Christian Weigert, Stefan Wiesinger
  • Publication number: 20090239401
    Abstract: A conductor track carrier is intended to contact-connect electrical components. The carrier has a flexible base film, a conductor track on the base film, and a contact-connection eye arranged in a contact-connection section of the conductor track carrier and electrically coupled to the conductor track. The conductor track carrier has a respective recess on two opposite sides of the contact-connection section, and web elements formed between the recesses in such a manner that the contact-connection section is pivotably mounted.
    Type: Application
    Filed: January 17, 2007
    Publication date: September 24, 2009
    Applicant: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Martin Fink, Christian Janisch, Karl Smirra
  • Publication number: 20090053943
    Abstract: The invention relates to a cable for bringing into contact with a contact point of a flexible strip conductor, to a contact strip for one or more cables of this type, and to a system for bringing control electronics, which are situated on a flexible printed circuit board, into contact with at least one electrical and/or electronic component. The component is, particularly, a mechatronic transmission or engine controller of a motor vehicle. A special contact with a welding boss is placed at the end of a cable. A bundle of cables of this type is fixed in a defined position by way of a contact strip. The invention enables, for the first time, one or more cables to be directly brought into contact with the contact point(s) of a flexible strip conductor. This advantageously eliminates additional contact points and parts such as mating connectors, etc. whereby leading to a distinct improvement in quality and reduction in costs.
    Type: Application
    Filed: September 30, 2005
    Publication date: February 26, 2009
    Applicant: Siemens Aktiengesellschaft
    Inventors: Martin Fink, Christian Janisch, Karl Smirra
  • Publication number: 20080253090
    Abstract: An IC component has a cooling arrangement that is embodied as an electronic housing provided with a cooling body. The IC component is directly disposed on the cooling body in the electronic housing. The invention advantageously provides a cooling arrangement for IC components that enables the IC component to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automotive field.
    Type: Application
    Filed: August 25, 2006
    Publication date: October 16, 2008
    Applicant: VDO AUTOMOTIVE AG
    Inventors: Christian Janisch, Karl Smirra
  • Publication number: 20080212268
    Abstract: A housing system for electronic devices, especially for the automobile sector has a top part and a bottom part. A pressure compensation film is fixed to the bottom part of the housing as a top part of the housing. Advantageously, the housing system is flexible, can be individually and thus variably adjusted to the space required, and encompasses a sealing system that is integrated in a pressure compensation element. The housing is suitable particularly for applications in the automobile sector.
    Type: Application
    Filed: June 22, 2006
    Publication date: September 4, 2008
    Applicant: VDO AUTOMOTIVE AG
    Inventor: Christian Janisch
  • Publication number: 20070297152
    Abstract: A system component of a control device, especially for a transmission or engine controller of a motor vehicle, is provided as a closed system component for a control device which can be transported, thereby allowing decentralized manufacturing of the system component. The system component has a hybrid circuit, equipped with electronic components, which is embedded in a printed circuit board, recessed in the center, in such a manner that the hybrid circuit is completely enclosed by the printed circuit board. The hybrid circuit and the printed circuit board are mounted on a base element and connected to each other via contact elements. A cover element is positioned on top of the hybrid circuit and the contact elements in such a manner that the hybrid circuit is fully encapsulated by the base element, the cover element and the printed circuit board from environmental influences.
    Type: Application
    Filed: December 5, 2005
    Publication date: December 27, 2007
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Christian Janisch, Johannes Mehler, Walther Seiwerth, Peter Stetter, Christian Weigert, Stefan Wiesinger