Patents by Inventor Christian Joos
Christian Joos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10693057Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.Type: GrantFiled: April 11, 2018Date of Patent: June 23, 2020Assignee: TDK-MICRONAS GMBHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Patent number: 10103320Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.Type: GrantFiled: May 4, 2016Date of Patent: October 16, 2018Assignee: TDK-Micronas GmbHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Publication number: 20180233658Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.Type: ApplicationFiled: April 11, 2018Publication date: August 16, 2018Applicant: TDK-Micronas GmbHInventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Publication number: 20170324028Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.Type: ApplicationFiled: May 4, 2016Publication date: November 9, 2017Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
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Patent number: 9620391Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.Type: GrantFiled: October 9, 2015Date of Patent: April 11, 2017Assignee: Micronas GmbHInventors: Wolfgang Hauser, Viktor Heitzler, Christian Joos
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Publication number: 20160035594Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.Type: ApplicationFiled: October 9, 2015Publication date: February 4, 2016Applicant: MICRONAS GMBHInventors: Wolfgang HAUSER, Viktor HEITZLER, Christian JOOS
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Patent number: 8822253Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.Type: GrantFiled: November 1, 2013Date of Patent: September 2, 2014Assignee: Micronas GmbHInventors: Tobias Kolleth, Pascal Stumpf, Christian Joos
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Publication number: 20140057395Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.Type: ApplicationFiled: November 1, 2013Publication date: February 27, 2014Applicant: Micronas GmbHInventors: Tobias KOLLETH, Pascal STUMPF, Christian JOOS
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Patent number: 8604599Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.Type: GrantFiled: March 9, 2012Date of Patent: December 10, 2013Assignee: Micronas GmbHInventors: Tobias Kolleth, Pascal Stumpf, Christian Joos
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Publication number: 20120228756Abstract: A semiconductor housing is provided that includes a metal support and a semiconductor body, a bottom side thereof being connected to the metal support. The semiconductor body has metal surfaces that are connected to pins by bond wires and a plastic compound, which completely surrounds the bond wires and partially surrounds the semiconductor body. The plastic compound has an opening on the top side of the semiconductor body, and a barrier is formed on the top side of the semiconductor body. The barrier has a top area and a base area spaced from the edges of the semiconductor body and an internal clearance of the barrier determines a size of the opening. Whereby, a portion of the plastic compound has a height greater than the barrier, and a fixing layer is formed between the base area of the barrier and the top side of the semiconductor body.Type: ApplicationFiled: March 9, 2012Publication date: September 13, 2012Inventors: Tobias KOLLETH, Pascal Stumpf, Christian Joos
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Patent number: 8203168Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.Type: GrantFiled: September 22, 2010Date of Patent: June 19, 2012Assignee: Micronas GmbHInventors: Felix Schinner, Christian Joos, Wolfgang Hauser, Michael Schmidt, Thomas Burke
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Publication number: 20110068460Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.Type: ApplicationFiled: September 22, 2010Publication date: March 24, 2011Inventors: Felix SCHINNER, Christian Joos, Wolfgang Hauser, Michael Schmidt, Thomas Burke
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Publication number: 20040113240Abstract: The invention relates to an electronic component (1) including a leadframe (2), composed of a platform (5), and possibly at least one electrical connecting piece (6′, 6″), wherein at least one electronic member (3) is located on the platform (5), and including a housing (4) that encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided to support the platform (5) during the fabrication process for the housing (4), and wherein at least a section of the at least one support region (7) projects from the housing (4).Type: ApplicationFiled: October 14, 2003Publication date: June 17, 2004Inventors: Wolfgang Hauser, Viktor Heitzler, Christian Joos