Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: The present invention provides a magnetron system, comprising a baseplate assembly. The baseplate assembly defining a housing portion and a power feedthrough. A sputtering target is disposed within the housing portion of the baseplate assembly. An electromagnetic assembly is disposed within the housing portion of the baseplate assembly. The electromagnetic assembly comprising a plurality of electromagnet pairs and a plurality of magnet pairs, wherein the plurality of electromagnet pairs and the plurality of magnet pairs are arranged in an alternating order such that at least one electromagnet pair of the plurality of electromagnet pairs is juxtapositioned between two magnet pairs of the plurality of magnet pairs, and at least one magnet pair of the plurality of magnet pairs is juxtapositioned between two electromagnet pairs of the plurality of electromagnet pairs.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: The present invention provides a magnetron system, comprising a baseplate assembly. The baseplate assembly defining a housing portion and a power feedthrough. A sputtering target is disposed within the housing portion of the baseplate assembly. An electromagnetic assembly is disposed within the housing portion of the baseplate assembly. The electromagnetic assembly comprising a plurality of electromagnet pairs and a plurality of magnet pairs, wherein the plurality of electromagnet pairs and the plurality of magnet pairs are arranged in an alternating order such that at least one electromagnet pair of the plurality of electromagnet pairs is juxtapositioned between two magnet pairs of the plurality of magnet pairs, and at least one magnet pair of the plurality of magnet pairs is juxtapositioned between two electromagnet pairs of the plurality of electromagnet pairs.

Abstract: The present invention provides a magnetron system comprising a baseplate assembly that defines a housing portion and a power feedthrough. A magnet assembly and a segmented target assembly are disposed within the housing portion. The segmented target assembly has an inner target segment having a plurality of target tiles. A plurality of electrical contacts are in electrical communication with the power feedthrough, wherein each electrical contact of the plurality of electrical contacts electrically contacts a respective target tile of the plurality of target tiles such that power is delivered from each electrical contact of the plurality of electrical contacts to each respective target tile of the plurality of target tiles.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: Various embodiments of a mechanical assembly for linear and rotational handling of electronic wafer substrates under high vacuum are disclosed herein.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: Various embodiments for an adjustable flow nozzle system having a manifold with a plurality of adjustable flow nozzles in which the flow rate of each adjustable flow nozzle may be individually adjusted are described herein.

Abstract: A system for removal of contaminating particles from a target chamber (1) which includes a target chamber having an aperture in the floor thereof for entry of a reciprocating shaft (7) for positioning a wafer (11) within the target chamber, a seal (21) disposed at the aperture and about the shaft to seal-the interior of the target chamber from the exterior of the target chamber at the seal and a removable shield mechanism (17), preferably of polytetrafluoroethylene, disposed within the target chamber, above the seal and around the shaft to retain particles scraped from the shaft. The shield mechanism has a pocket (29) disposed over the seal and around the shaft to retain the particles therein isolated from the target chamber. The shield mechanism comprises a shield (17) disposed around the shaft and a collar (18) contacting the shield and the floor of the target chamber to form the pocket with the seal. The collar further includes a lip (16) extending toward the shaft for supporting the shield thereon.

Abstract: A system for removal of contaminating particles from a target chamber (1) which comprises the target chamber having an aperture (3) for entry of an ion beam (2) therein, an orienting device (7, 9, 13, 15) within the target chamber for orienting a wafer (11) with respect to the ion beam and a reusable, removable shield (23), preferably of stainless steel, disposed along the interior walls of the target chamber and secured to the interior walls. A securing device (24) is provided for releasably securing the shield to the interior walls of the target chamber.