Patents by Inventor Christian Kersting

Christian Kersting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module bonding wire connection method
    Patent number: 9925588
    Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: March 27, 2018
    Assignee: Infineon Technologies AG
    Inventors: Daniel Bolowski, Achim Froemelt, Christian Kersting, Christian Stahlhut
  • SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
    Publication number: 20150333034
    Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.
    Type: Application
    Filed: May 11, 2015
    Publication date: November 19, 2015
    Inventors: Daniel Bolowski, Achim Froemelt, Christian Kersting, Christian Stahlhut