Abstract: A data center is configured in a room using alternating rows of racks containing heat-generating electronic devices and air conditioners or liquid conditioners. Chilled fluid, such as water or a refrigerant, for the air conditioners or liquid conditioners is supplied through redundant plumbing comprising first and second supply and return pipes below a raised floor. Attached to this redundant plumbing are standard fluid couplings configured to couple to either air conditioners or liquid conditioners. The air conditioners and liquid conditioners use the same chilled fluid so that they may share the redundant plumbing and continually receive chilled fluid in the event of the failure of one of the chilled fluid supplies.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Abstract: In one example, a data center may be built in modular components that may be pre-manufactured and separately deployable. Each modular component may provide functionality such as server capacity, cooling capacity, fire protection, resistance to electrical failure. Some components may be added to the data center by connecting them to the center's utility spine, and others may be added by connecting them to other components. The spine itself may be a modular component, so that spine capacity can be expanded or contracted by adding or removing spine modules. The various components may implement functions that are part of standards for various levels of reliability for data centers. Thus, the reliability level that a data center meets may be increased or decreased to fit the circumstances by adding or removing components.

Abstract: A computer server is configured to electrically and mechanically couple with a plurality of different power modules. These power modules are interchangeable, and all fit within the form factor of the server, eliminating the use of PDUs within the server rack. The server may be configured in the factory or in the field to use either the single-phase AC power configuration, the 3-phase AC power configuration, or any other power configuration, such as DC, desired.

Abstract: A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity.

Abstract: Unlike symmetric power feeds for dual-corded server environments, an asymmetrical power system for high availability environments uses an imbalanced power feed system, allowing lower cost implementation and, in some cases, reduced energy loss in the primary power supply path. One asymmetric power feed uses a direct power feed to supply normal operating power and uses a second system to supply back up power via a switched, conditioned, path with UPS and generator. Because the main power delivery is through the direct line, reliability and power loss are improved.

Abstract: A computer system takes redundancy into account when allocating hardware resources to workloads in the event of a failure of a non-data-handling component.

Abstract: A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.

Abstract: A system comprises a first equipment rack, a power distribution unit (PDU) and a plurality of rack connectors. The PDU is mounted in the first equipment rack and is configured to provide alternating current (AC) power that comprises a plurality of phases. The plurality of rack connectors mount within the first equipment rack, and each of the plurality of rack connectors couples to the PDU and provides access to the plurality of phases. Each rack connector is usable to accommodate a first device installed in the equipment rack that uses one or more of the plurality of phases, and is also usable to accommodate a second device installed in the equipment rack that uses one or more of the plurality of phases, thereby permitting each rack connector to couple to any of a plurality of devices, and permitting each of the plurality of devices to use any number of the plurality of phases. The number of phases used by the first device differs from the number of phases used by the second device.

Abstract: An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center'core functions. Various illustrative techniques for managing a power-efficient data center are also described.

Abstract: An illustrative power-efficient data center is described for operating in an uncontrolled environment in one scenario. The data center includes an air moving system that applies unconditioned air to its resource items. The resource items are stripped down to provide a substantially minimum set of components for performing the data center's core functions. Various illustrative techniques for managing a power-efficient data center are also described.

Abstract: An equipment rack including front and back doors is configured with fans for air cooling enclosed electronic devices in both doors. The fans in each door are sufficient, by themselves, to provide sufficient airflow to cool the electronic devices. The two doors include switches and magnetic interlocks configured such that when one door is opened, the magnetic interlock on the other door is activated preventing both doors from being opened at the same time. This ensures that at least one door is always closed while the system is powered up, and since the fans in each door provide sufficient cooling for the equipment rack, the rack is always sufficiently cooled to prevent electronic device failure from overheating.

Abstract: An electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving temperature information. The clock frequency of the electronic device is varied in response to the temperature of the electronic device, thus lowering speed and power consumption of the device during periods of higher than normal temperature. Alternately, an electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving power supply information. The clock frequency and possibly the power supply voltage of the electronic device is varied in response to the power supply status of the electronic device, thus lowering speed and power consumption of the device during periods of lower than normal power supply current capability.

Abstract: A server with a flexible cooling scheme is disclosed. The server comprises a case and a fan. When the server is in a first cooling configuration the fan is configured to force the gas past a first area to be cooled and out to the outside of the case through a second opening in the case. When the server is in a second cooling configuration, the server further comprises a heat exchanger located in the first area and configured to seal the first opening in the case thereby preventing outside gas from entering the first area. When the server is in the second cooling configuration, a sealing device is configured to seal the second opening thereby redirecting the first fan to force the gas past the first area to be cooled and back into the first area, thereby re-circulating the gas inside the case.

Abstract: A system has a plurality of electronic components that are powered by a power source, and each of the components is associated with a respective power cap. The system further has logic configured to monitor power consumption of the electronic components over a duration and dynamically adjust at least one power cap associated with at least one of the electronic components based on the monitored power consumption.

Abstract: Disclosed are scalable computing pods that may be embodied in trailers, storage containers, or other portable structures that optimize computing, power, cooling and building infrastructure. The pods integrate required power and cooling infrastructure to provide a standalone turnkey computing solution. A user connects the pod to utility AC power and a data pipe. The scalable computing pods utilize liquid cooling, eliminate coolant conversions, and eliminate unnecessary power conversion to drastically improve efficiency.

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.

Abstract: A method of manufacturing a computing apparatus may include providing a plurality of computer components for the computing apparatus. The computing apparatus and the plurality of computer components can be transported from an origin to a geographically distant destination with a transport vehicle. Manufacture of the computing apparatus is substantially completed during the transporting of the computing apparatus.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A heat-sink structure includes a base and fins, the latter defining gaps with a cross-sectional area less than 24 mm2.