Abstract: An electrical contact element is disclosed. The contact element includes: a housing with an upper surface, a lower surface opposite the upper surface, and a side surface connecting the upper surface to the lower surface, a lower row of electrical connection pins protruding from the side surface, and an upper row of electrical connection pins protruding from the side surface. In the viewing direction perpendicular to the side surface, the connection pins of the upper row are arranged offset from the connection pins of the lower row and, in the viewing direction parallel to the side surface and along the upper or lower row of connection pins, the connection pins of the upper row intersect with the connection pins of the lower row.

Abstract: A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

Abstract: A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

Abstract: A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

Abstract: A contact assembly for an electronic component includes a wiring substrate having an upper face, a lower face and at least one contact connection surface on the upper face. At least one bonding strip is provided for connection to the at least one contact connection surface. The at least one contact connection surface is disposed on at least one metal-filled recess in the volume of the wiring substrate. A semiconductor component, an electronic component and a method for producing an electronic component are also provided.

Abstract: A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration ; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

Abstract: A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.

Abstract: A printed circuit board has first, second, and third printed circuit board sections extending along a longitudinal direction between two transverse edge outer sides of the printed circuit board. The printed circuit board has at each of its two longitudinal ends a respective transverse edge strip, which has regions of the first, second, and third printed circuit board sections and extends continuously transversely with respect to the longitudinal direction along a transverse edge outer side. A depression is formed in the third printed circuit board section on the first printed circuit board side between the two transverse edge strips. The first and/or second printed circuit board sections has a first metallic conductor track section that extends electrically conductively right into one or both of the two transverse edge strips.

Abstract: The invention concerns a method of connecting a first material to a second material by means of a heat-activatable adhesive material (8) in aircraft construction, wherein the adhesive material (8) is arranged between the first material and the second material and an induction heat which is adequate to activate the adhesive material (8) is generated. The first material and/or the second material and/or the adhesive material (8) have an induction heat-generating means. The induction heat-generating means is a non-woven metallic mesh and/or the induction heat-generating means (53) has an amount of carbon fibers for induction heat generation. The invention further concerns an apparatus comprising a first material and a second material, wherein the first material and the second material have a connection which can be produced by a heat-activatable adhesive material arranged between the first material and the second material, in accordance with the method in accordance with the invention.

Abstract: The invention concerns a method of connecting a first material to a second material by means of a heat-activatable adhesive material (8) in aircraft construction, wherein the adhesive material (8) is arranged between the first material and the second material and an induction heat which is adequate to activate the adhesive material (8) is generated. The first material and/or the second material and/or the adhesive material (8) have an induction heat-generating means. The induction heat-generating means is a non-woven metallic mesh and/or the induction heat-generating means (53) has an amount of carbon fibers for induction heat generation. The invention further concerns an apparatus comprising a first material and a second material, wherein the first material and the second material have a connection which can be produced by a heat-activatable adhesive material arranged between the first material and the second material, in accordance with the method in accordance with the invention.

Abstract: A method of adhesively bonding a first component to a second component, which comprises a peripheral zone with which the first component is adhesively bonded in overlapping manner is provided.