Abstract: The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Abstract: The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a reducing agent or a source of a reducing agent, and a combination comprising i) N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine or a salt thereof, and ii) N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid or a salt thereof, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising—a source of copper ions, —a reducing agent or a source of a reducing agent, and—a combination of i) at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, and ii) one or more of a compound which is selected from the group consisting of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis(2-hydroxypropyl)ethylenediamine, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.

Abstract: A method for depositing a coating of a first metal onto a workpiece 12 which exposes a second metal by a) providing a bath liquid 16 containing components containing ions of the first metal to be deposited, at least one complexing agent for the second metal and at least one acid, b) depositing the coating of first metal from the bath liquid 16 onto the workpiece 12, c) feeding the bath liquid 16 into a tank 18, d) cooling the bath liquid 16 in the settling tank 18 for generating a precipitate and filtrate, the precipitate comprised of the second metal and the at least one complexing agent, f) returning the filtrate to the bath liquid 16 and g) replenishing bath components to the bath liquid 16. In separating precipitate from the filtrate a pressure difference is generated by the filter.

Abstract: A device (1) for the wet-chemical treatment of material to be treated (10), in particular of flat material to be treated (10), comprises a treatment vessel (2) for treating the material to be treated (10) with a treatment liquid (9), a transport device (24) for transporting the material to be treated (10) through the treatment vessel (2), and a feed device (11) for feeding an inert gas (16) into the treatment vessel (2).

Abstract: The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.