Abstract: A stamp replication device for producing stamps for the production of at least one of microstructured and nanostructured components has a platform, a cover that is positionable on the platform and a holding device for a stamp carrier, wherein the holding device is provided on the cover or on the platform and includes a carrier as well as a microstructured vacuum surface on the carrier for holding the stamp carrier. In addition, a method for producing a holding device for a stamp replication device as well as a method for producing a stamp are specified.

Abstract: An integrated optoelectronic device comprises a substrate with a silicon layer comprising one or more electronic components. An interconnect stack comprising a plurality of metal levels is arranged on the substrate. A front-end-of-line (FEOL) optical waveguide on the substrate has an optical FEOL coupling section. A photonic component is arranged in the interconnect stack at a distance from the substrate. A back-end-of-line (BEOL) optical waveguide in the interconnect stack is optically coupled to the photonic component and has an optical BEOL coupling section. An optical interconnect structure is arranged and configured for optically coupling radiation from the BEOL coupling section into the FEOL coupling section and vice versa. The optical interconnect structure comprises a stack of wave-guide elements made of a first dielectric material, which each are embedded in a second dielectric material and which in a desired wavelength range have an index of refraction higher than the second dielectric material.

Abstract: An integrated optical waveguide formed in a substrate is disclosed. The integrated optical waveguide includes a hole, a core, and one or more bridges. The hole extends in an axial direction of the substrate. The core is made of the same material as the substrate, arranged in the hole, and extends in the axial direction. The core has a first refractive index and a sidewall which is at least partly surrounded by a surrounding material which has a second refractive index which is lower than the first refractive index and such that a refractive index difference between the first refractive index and the second refractive index allows to guide light within the core. The bridges extend from the sidewall of the core to a sidewall of the hole. The bridges may be made of the same material as the substrate. Furthermore, one or more of the sidewalls of the core, the hole, and the bridges may be tapered sidewalls which include a section which is oblique to the axial direction.

Abstract: The present invention relates to producing an electro-optical phase shifter such that it may be integrated into a front-end of line of an electronic-photonic integrated circuit. A conducting bottom layer with a first refractive index is provided. A center layer including a ferroelectric material and with a second refractive index is provided on top of a first region of the conducting bottom layer, such that the center layer is not on top of a second region of the conducting bottom layer. A conducting top layer with a third refractive index is provided on top of the center layer. The second refractive index is lower than the first refractive index and lower than the third refractive index, such that the conducting bottom layer, the center layer, and the conducting top layer form a slot waveguide. A first electrical connector which connects the second region of the conducting bottom layer with an upper layer is provided.

Abstract: The present invention relates to a slot waveguide formed by a vertical material stack comprising a top layer with a first refractive index, a center layer including a ferroelectric material and with a second refractive index, and a Si1-xGex pseudosubstrate layer with 0<x?1 and with a third refractive index. The center layer is grown on the Si1-xGex pseudosubstrate layer. The second refractive index is lower than the first refractive index and lower than the third refractive index. The slot waveguide can be included in a phase-shifter including two vertically arranged electrodes configured for providing a vertical electrical field (Ev) extending between the top layer and the bottom layer of the slot waveguide and for providing a complementary-metal-oxide-semiconductor compatible driver voltage. The phase-shifter can be configured for providing a linear electro-optical effect inside the center layer of the slot waveguide.

Abstract: A vehicular radar sensing system includes a radar sensor disposed at a vehicle and having a printed circuit board (PCB). The radar sensor includes an antenna structure having a transmitting port for a transmitter of the radar sensor and a receiving port for a receiver of the radar sensor. The antenna structure includes a wall structure that extends from a first side of the antenna structure toward a first side of the PCB to at least partially define a transmitting area and a receiving area to isolate radio frequency signals at the transmitting area from radio frequency signals at the receiving area. The antenna structure includes a transmitting wave-guide that guides transmitted radio signals from the transmitter through the transmitting area to the transmitting port. The antenna structure includes a receiving wave-guide that guides received radio signals from the receiving port through the receiving area to the receiver.

Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.

Abstract: The present invention relates to producing an electro-optical phase shifter such that it may be integrated into a front-end of line of an electronic-photonic integrated circuit. A conducting bottom layer with a first refractive index is provided. A center layer including a ferroelectric material and with a second refractive index is provided on top of a first region of the conducting bottom layer, such that the center layer is not on top of a second region of the conducting bottom layer. A conducting top layer with a third refractive index is provided on top of the center layer. The second refractive index is lower than the first refractive index and lower than the third refractive index, such that the conducting bottom layer, the center layer, and the conducting top layer form a slot waveguide. A first electrical connector which connects the second region of the conducting bottom layer with an upper layer is provided.

Abstract: The present invention relates to a slot waveguide formed by a vertical material stack comprising a top layer with a first refractive index, a center layer including a ferroelectric material and with a second refractive index, and a Si1-xGex pseudosubstrate layer with 0<x?1 and with a third refractive index. The center layer is grown on the Si1-xGex pseudosubstrate layer. The second refractive index is lower than the first refractive index and lower than the third refractive index. The slot waveguide can be included in a phase-shifter including two vertically arranged electrodes configured for providing a vertical electrical field (E) extending between the top layer and the bottom layer of the slot waveguide and for providing a complementary-metal-oxide-semiconductor compatible driver voltage. The phase-shifter can be configured for providing a linear electro-optical effect inside the center layer of the slot waveguide.

Abstract: Examples of the present disclosure relate to metadata-assisted inventory management. Image data relating to a device is captured and further enriched with metadata, such as customer information, current event data, and/or log data associated with the device. The enriched image data may be processed by a decision engine to generate determinations based on the image data in combination with the metadata. For example, an equipment classification decision engine generates an equipment classification for telecommunications equipment therein. As another example, a cost modeling decision engine processes the enriched image data to evaluate a cost associated with the telecommunications equipment or a service evaluation decision engine may process the enriched image data to determine whether telecommunications equipment and/or an associated service are performing as expected.

Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.

Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established within the housing structure when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via a clip that at least partially circumscribes a junction between the front housing and the rear housing. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.

Abstract: The invention relates to a photonic sensor chip comprising a semiconductor substrate with a cavity extending from a back side through an entire depth of the semiconductor substrate, a photonic plane located on the front side of the semiconductor substrate. The chip includes a photonic particle sensor element with an active-surface element having an exposed active surface facing towards the back side of the semiconductor substrate, for capturing selected particles from at least one fluid or gas to which the active surface is exposable. The cavity provides access to the active surface from the back side. The photonic particle sensor element receives an optical input wave via the photonic plane, to expose captured particles on the active-surface element to interaction with the optical input wave and to provide a resulting optical output wave having a spectral component indicative of the interaction between the optical input wave and captured particles.

Abstract: A vehicular camera includes a front housing portion that accommodates a lens and an imager, a circuit board disposed at the front housing portion, a rear housing portion and a coaxial connecting element at the rear housing portion. The coaxial connecting element includes a first coaxial connector portion and a second coaxial connector portion. The first coaxial connector portion extends outward from the rear housing portion and the second coaxial connector portion extends inward from the rear housing portion. The circuit board has a coaxial connector established thereat. When the rear housing portion is mated with the front housing portion, the second coaxial connector portion electrically connects to the coaxial connector to electrically connect the coaxial connecting element with circuitry at the circuit board. The first coaxial connector portion is configured to connect to a coaxial cable of a vehicle when the vehicular camera is disposed at the vehicle.

Abstract: The invention relates to an electrooptical device comprising a semiconductor substrate having a front side and a back side, at least one photonic component arranged on the front side of the semiconductor substrate, the photonic component comprising an active layer made of a non-linear optical material, wherein at least one cavity, extends through the semiconductor substrate and connects the active layer on the front side of the semiconductor substrate with the back side of the semiconductor substrate.

Abstract: A vehicular camera includes a front housing portion that accommodates a lens and an imager, a circuit board disposed at the front housing portion, a rear housing portion and a coaxial connecting element at the rear housing portion. The coaxial connecting element includes a first coaxial connector portion and a second coaxial connector portion. The first coaxial connector portion extends outward from the rear housing portion and the second coaxial connector portion extends inward from the rear housing portion. The circuit board has a coaxial connector established thereat. When the rear housing portion is mated with the front housing portion, the second coaxial connector portion electrically connects to the coaxial connector to electrically connect the coaxial connecting element with circuitry at the circuit board. The first coaxial connector portion is configured to connect to a coaxial cable of a vehicle when the vehicular camera is disposed at the vehicle.

Abstract: A radar sensor for a vehicular radar sensing system includes a housing structure and at least one printed circuit board (PCB). The housing structure includes a front housing and a rear housing. The PCB is accommodated between the front housing and the rear housing in a cavity established within the housing structure when the front housing and the rear housing are joined together. The rear housing may be joined to the front housing via a clip that at least partially circumscribes a junction between the front housing and the rear housing. The rear housing may be joined to the front housing via an intermediate frame disposed between the front housing and the rear housing, with the rear housing secured to the intermediate frame via a plurality of fasteners and with the front housing secured to the intermediate frame via welding.

Abstract: The invention relates to a photonic sensor chip comprising a semiconductor substrate with a cavity extending from a back side through an entire depth of the semiconductor substrate, a photonic plane located on the front side of the semiconductor substrate. The chip includes a photonic particle sensor element with an active-surface element having an exposed active surface facing towards the back side of the semiconductor substrate, for capturing selected particles from at least one fluid or gas to which the active surface is exposable. The cavity provides access to the active surface from the back side. The photonic particle sensor element receives an optical input wave via the photonic plane, to expose captured particles on the active-surface element to interaction with the optical input wave and to provide a resulting optical output wave having a spectral component indicative of the interaction between the optical input wave and captured particles.

Abstract: A method of assembling a vehicular camera includes providing a front housing portion and a rear housing portion and attaching a circuit board at the front housing portion. A one-piece coaxial connecting element is provided at the rear housing portion. With the coaxial connecting element provided at the rear housing portion, a first coaxial cable connector extends outward from the outer side of the rear housing portion and a second coaxial cable connector extends inward from the inner side of the rear housing portion. As the rear housing portion is mated with the front housing portion, the second coaxial cable connector engages the third coaxial cable connector at the circuit board to electrically connect the coaxial connecting element with circuitry at the circuit board. The first coaxial cable connector is configured to connect to a coaxial cable of a vehicle when the vehicular camera is disposed at the vehicle.

Abstract: A method of assembling a vehicular camera includes providing a front housing portion and a rear housing portion and attaching a circuit board at the front housing portion. A one-piece coaxial connecting element is provided at the rear housing portion. With the coaxial connecting element provided at the rear housing portion, a first coaxial cable connector extends outward from the outer side of the rear housing portion and a second coaxial cable connector extends inward from the inner side of the rear housing portion. As the rear housing portion is mated with the front housing portion, the second coaxial cable connector engages the third coaxial cable connector at the circuit board to electrically connect the coaxial connecting element with circuitry at the circuit board. The first coaxial cable connector is configured to connect to a coaxial cable of a vehicle when the vehicular camera is disposed at the vehicle.