Abstract: A method and computer system for checking a netlist N. An I/O connectivity list I1 for a first electrical package P1 is provided. I1 includes I/O locations on a surface S1 of the first electrical package P1. An I/O connectivity list I2 for a second electrical package P2 is also provided. I2 includes I/O locations on a surface S2 of the second electrical package P2. A netlist N that describes electrical nets between I/O locations on S1 and I/O locations on S2 is additionally provided. Denoting I as I1 and I2 collectively, a relationship exists between the I/O locations in N and the I/O locations in I, wherein the relationship is either a mutually consistent relationship or a mutually inconsistent relationship. The method and computer system determines whether the relationship is the mutually consistent relationship. An algorithm within the computer system may implement the method.

Abstract: A method and computer system for checking a netlist N. An I/O connectivity list I1 for a first electrical package P1 is provided. I1 includes I/O locations on a surface S1 of the first electrical package P1. An I/O connectivity list I2 for a second electrical package P2 is also provided. I2 includes I/O locations on a surface S2 of the second electrical package P2. A netlist N that describes electrical nets between I/O locations on S1 and I/O locations on S2 is additionally provided. Denoting I as I1 and I2 collectively, a relationship exists between the I/O locations in N and the I/O locations in I, wherein the relationship is either a mutually consistent relationship or a mutually inconsistent relationship. The method and computer system determines whether the relationship is the mutually consistent relationship. An algorithm within the computer system may implement the method.

Abstract: A computer program receives a large plurality of module design parameters and provides as output a graphical representation of the design together with text files that rate module wireability, including die pad position, attachment of each die pad to its BGA pad, and net cross-over; summarizes input parameters; creates a truth table for rating wireability and thermal requirements; provides cost sensitive parameters such as gold area, drill size and number requirements.