Patents by Inventor Christian Remy

Christian Remy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6554244
    Abstract: The invention related to a device for supporting a miniaturized, especially electronic or optical component, including a first and a second part, the second part is affixed to the first part on one side at a fixing point, in a cantilevered manner, and supports the component. The projection of the support area of the component onto the first part lies between the fixing point and a predetermined point of reference on the first part. The position of the support area of the component on the second part is chosen in relation to the fixing point between the first and second part and the respective material for the first and second parts is chosen with a specific temperature-dependent expansion coefficient &agr;1 and &agr;2, in such a way that the influence of the temperature-dependent expansion of the first and second part on the position of the support area of the component is at least partially offset in relation to the point of reference.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: April 29, 2003
    Assignees: Leica Geosystems AG, MTA Automation AG
    Inventors: Christian Remy De Graffenried, Marco Antonio Scussat
  • Patent number: 6380513
    Abstract: A process for fastening a miniaturized component (2), in particular assembled in a modular manner, on a baseplate (1) by a solder joint is described. A side (4) of the component (2) is coated with a layer (5) of solder material, and the baseplate (1) is at least partly coated with a layer of metal (6, 6′, 6″). The component (2) is arranged above the baseplate (1), the metal layer and the layer (5) of solder material being a vertical distance apart and not in contact with one another. Heat energy is then supplied from the side of the baseplate (1) for melting solder material of the layer (5) of solder material on the side (4) of the component (2) until a drop forms, with the result that the drop (5′) of solder material fills the space between the component (2) and the baseplate (1) for mutual fastening.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: April 30, 2002
    Assignees: Leica Geosystems AG, MTA Automation AG
    Inventor: Christian Remy De Graffenried
  • Patent number: 5931911
    Abstract: An information processing device IPD implanted in an information processing resource RES which enables dialog between an administration system MAN and the resource RES, by the agency of a standard protocol such as SNMP and through a network such as TCP/IP. The device PID is constituted on the one hand by a selection and dialog manager DIS including a configuration file CF, and on the other by a set of specific agents A1, A2, . . . , An of the protocol SNMP, the protocol which is also used in the device IPD. The manager DIS receives requests form the system MAN and, after reading the file CF, dispatches them, as a function of the object to which they pertain, to one or more of the agents A1, A2, . . . , An and then receives the responses to the requests sent by the appropriate agents and transmits them to the system MAN.
    Type: Grant
    Filed: November 17, 1993
    Date of Patent: August 3, 1999
    Assignee: Bull S.A.
    Inventors: Christian Remy, Olivier Miakinen