Patents by Inventor Christian Ressel

Christian Ressel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9144855
    Abstract: The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mold that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: September 29, 2015
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Reiner Anton, Brigitte Heinecke, Michael Ott, Christian Ressel
  • Publication number: 20110244264
    Abstract: The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mould that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
    Type: Application
    Filed: November 19, 2009
    Publication date: October 6, 2011
    Inventors: Reiner Anton, Brigritte Heinecke, Michael Ott, Christian Ressel
  • Patent number: 4774993
    Abstract: A device, configured as a double mold, for casting terminal bars (straps) and terminal poles onto the lugs of a completely assembled plate group for electric storage batteries ensures optimum attachment of all of the lugs (both polarities) to the molten bar lead if the heat exchange between the bar lead and the dipped volume of each negative or positive lug is identical. This requirement is met by causing the negative and positive casting molds, together with their contents, to form thermally equivalent sections or blocks, which are equalized if necessary, by changing the dimensions (thickness) of the mold's walls. When the lugs are made of lead or a lead alloy, such a double mold also makes it possible, during a subsequent two-stage cooling process, to first allow the terminal poles to solidify, simultaneously, and to then allow the terminal bars to solidify, simultaneously.
    Type: Grant
    Filed: May 19, 1987
    Date of Patent: October 4, 1988
    Assignee: Varta Batterie Aktiengesellschaft
    Inventors: Bernhard Kallup, Wolfgang Glittenberg, Christian Kubis, Gerolf Richter, Christian Ressel