Patents by Inventor Christian Rheault

Christian Rheault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor copper bond pad surface protection
    Patent number: 7199475
    Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: April 3, 2007
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
  • Semiconductor copper bond pad surface protection
    Publication number: 20050181191
    Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
    Type: Application
    Filed: March 21, 2005
    Publication date: August 18, 2005
    Applicant: Kulicke & Soffa Investments, Inc
    Inventors: Timothy Ellis, Nikhil Murdeshwar, Mark Eshelman, Christian Rheault
  • Semiconductor copper bond pad surface protection
    Patent number: 6885104
    Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: April 26, 2005
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
  • Semiconductor copper bond pad surface protection
    Publication number: 20020135077
    Abstract: Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
    Type: Application
    Filed: May 22, 2002
    Publication date: September 26, 2002
    Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
  • Semiconductor copper bond pad surface protection
    Patent number: 6413576
    Abstract: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: July 2, 2002
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
  • SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
    Publication number: 20020054955
    Abstract: Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
    Type: Application
    Filed: October 5, 1999
    Publication date: May 9, 2002
    Inventors: TIMOTHY W. ELLIS, NIKHIL MURDESHWAR, MARK A. ESHELMAN, CHRISTIAN RHEAULT