Abstract: Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.

Abstract: Method for producing a polyacrylate adhesive compound by a hot-melt method in which a polyfunctional ?-cleaving initiator, which is present as an oligomer, is added to the polymer to be crosslinked prior to the hot-melt method and ultraviolet crosslinking is carried out after treatment in the hot-melt method.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.

Abstract: Use of an adhesive sheet having a carrier film provided with an adhesive on one side for covering microtitre plates, the adhesive being formed from at least one acid- or acid anhydride-modified vinylaromatic block copolymer, at least one tackifier resin and at least one metal chelate.

Abstract: Heat-activable adhesive tape particularly for producing and further processing electronic components and conductor tracks, with an adhesive composed at least of a) a polyamide having terminal amino and/or acid groups, b) an epoxy resin, c) if desired, a plasticizer, the polyamide reacting with the epoxy resin at temperatures of at least 150° C., and the ratio in weight fractions of a) to b) lying between 50:50 to 99:1.

Abstract: The invention relates to the use of a pressure-sensitive adhesive comprising at least one resin-polymer blend of at least 50% by weight of one or more block copolymers comprising polymer blocks based on vinylaromatics and comprising polymer blocks based on 1,3-dienes and not more than 50% by weight of at least one tackifier resin for an adhesive tape for bonding flexible printing plates to printing cylinders or printing sleeves.

Abstract: A pressure-sensitive adhesive which develops a high bond strength to substrates of low surface energies, even at low temperatures. The adhesive is composed of a first block copolymer A-B and a second block copolymer which is composed of at least two and not more than eleven connected subunits A-B, A being in each case a polymer block comprising vinylaromatic monomer units and B being in each case a poly(1,3-diene). The first block copolymer is present in the adhesive in a fraction of at least 50% by weight, based on the total mass of the block copolymers in the adhesive. The adhesive additionally contains tackifier resins, of which at least 30% by weight are liquid at room temperature and which are miscible with the polymer blocks B, but not with the polymer blocks A. An adhesive tape with the pressure-sensitive adhesive is also described.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acid- or acid anhydride-modified acrylonitrile-butadiene copolymer, and b. an epoxy resin, the weight ratio of the two components a/b being greater than 1.5 and no additional nonpolymer hardener being used.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a. an acrylonitrile-butadiene copolymer, with a weight fraction of 40% to 80% by weight, b. a polyvinyl acetal, with a weight fraction of 2% to 30% by weight, c. an epoxy resin, with a weight fraction of 10% to 50% by weight, and d. a hardener, the epoxide groups being chemically crosslinked with the hardener at high temperatures.

Abstract: Deviation ring for paste, comprising an annular rebound wall for a self-distributing centrifuge, positioned opposite the discharge slot of the centrifuge, the tangent of which is at an angle ? of 3 to 60°, as seen over the entire opening width of the discharge slot.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a) an epoxide-modified vinylaromatic block copolymer, b) an epoxy resin and c) a hardener which performs crosslinking with the epoxide groups at high temperatures, the ratio of a to b being between 40:60 and 80:20.

Abstract: An adhesive sheet comprising (i) at least one thermoplastic polymer and/or one thermoplastic elastomer, (ii) at least one resin, and (iii) at least one organically modified phyllosilicate and/or bentonite.

Abstract: Heat-activable adhesive tape for producing and further processing flexible conductor tracks, with an adhesive composed at least of a) an epoxide-modified vinylaromatic block copolymer, b) an epoxy resin and c) a hardener which performs crosslinking with the epoxide groups at high temperatures, the ratio of a to b being between 40:60 and 80:20.

Abstract: Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of: a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxidized vinylaromatic block copolymer.

Abstract: Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxide compound.

Abstract: A pressure sensitive adhesive for single-sided or double-sided adhesive sheet strips which can be redetached without residue or destruction by extensive stretching in the plane of the bond, composed of a mixture comprising a block copolymer and a tackifier, characterized in that at least one compound which is swellable in H2O is incorporated into the mixture.

Abstract: An adhesive comprising at least a) polyisobutylene and b) at least one tackifying resin, c) the molecular weight distribution of the polyisobutylene having two relative maxima, specifically d) one between 50,000 and 200,000 g/mol and e) a second between 1.0×106 and 3.5×106 g/mol.

Abstract: The invention relates to a method for producing a polyacrylate adhesive compound by a hot-melt method. The inventive method is characterized in that a polyfunctional &agr;-splitting agent which is present as an oligomer is added to the polymer to be crosslinked prior to the hot-melt method and UV crosslinking is carried out after treatment in the hot-melt method.