Patents by Inventor Christian Rottmair

Christian Rottmair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making a continuously cast slab and the resulting mold plate
    Patent number: 11318640
    Abstract: A martensitic stainless steel is produced by continuously casting a melt comprising 0.0.04%-0.065% by weight C, about 0.25%-0.5% by weight Si, about 0.9%-1.2% by weight Mn, up to 0.025% P by weight, about 0.1%-0.16% by weight S, about 11.9%-12.8% by weight Cr, up to about 0.35% by weight Ni, about 0.5%-0.65% by weight Cu, about 0.03%-0.06% by weight N, about 0.02%-0.1% by weight V, and the balance being Fe with residual impurities, at a temperature between 2730° F. to 2820° F. and a specific casting speed to form a continuous strand of the alloy while not splitting or cracking. The strand is cut to length to form a slab which is descaled and hot worked during the subsequent hot working process where its thickness is reduced to form a plate of a specific gauge and width while not splitting or cracking at a segregation line through the slab and plate during hot working. Hot working of the continuously cast slab may be provided by either rolling or forging or a combination of both. The mold plate is air cooled.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: May 3, 2022
    Assignee: EDRO SPECIALTY STEELS, INC.
    Inventors: Terry O. Henn, Kristopher D. Welch, Christian A. Rottmair, Robert J. Friedrich, Michael A. Guscott
  • Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
    Patent number: 9576844
    Abstract: A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: February 21, 2017
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Method for Manufacturing a Composite Wafer having a Graphite Core, and Composite Wafer having a Graphite Core
    Publication number: 20160086844
    Abstract: A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer to a semiconductor wafer through the bonding layer.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 24, 2016
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
    Patent number: 9224633
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: December 29, 2015
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • METHOD FOR MANUFACTURING A COMPOSITE WAFER HAVING A GRAPHITE CORE, AND COMPOSITE WAFER HAVING A GRAPHITE CORE
    Publication number: 20140335676
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Application
    Filed: July 24, 2014
    Publication date: November 13, 2014
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
    Patent number: 8822306
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: September 2, 2014
    Assignee: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp
  • Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core
    Publication number: 20120083098
    Abstract: According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
    Type: Application
    Filed: August 9, 2011
    Publication date: April 5, 2012
    Applicant: Infineon Technologies AG
    Inventors: Rudolf Berger, Hermann Gruber, Wolfgang Lehnert, Guenther Ruhl, Raimund Foerg, Anton Mauder, Hans-Joachim Schulze, Karsten Kellermann, Michael Sommer, Christian Rottmair, Roland Rupp