Abstract: The present invention relates to a composition, preferably for bonding together metal sheets, comprising: a. 1 part by mole of at least one linear epoxy resin with an average epoxy equivalent weight of 600 to 5,000 g/mole and an epoxy functionality of 2, b. 0.4 to 0.8 parts by mole of at least one non-linear epoxy resin having an average epoxy equivalent weight of 180 to 350 g/mole and an average epoxy functionality of at least 3, c. 0.8 to 1.3 parts by mole of at least one basic hardener comprising at least two free amine-bonded hydrogen atoms, and d. 0.9 to 1.2 parts by mole of at least one crosslinker comprising at least two blocked isocyanate groups.

Abstract: Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.

Abstract: Various embodiments include a circuit carrier comprising: an installation place for an electronic component; and a deposit of a joining adjuvant applied to the installation place. The installation place has at an edge, a recess forming a depression in a surface of the circuit carrier. The deposit comprises a sintered material with a protuberance at an edge of the deposit.

Abstract: Various embodiments include a method for producing a structural unit to be soldered to a component by diffusion soldering and formed independently of the component comprising: providing a substrate; applying a paste with both metal particles and solder particles different from the metal particles onto at least one subregion of the substrate using a printing technique; and infiltrating the paste with solder in absence of the component, wherein the paste infiltrated with the solder forms a solder carrier layer. The solder infiltrating the paste is applied as at least one inherently rigid shaped part. A surface topography of the paste is modified by a stamp on the substrate.

Abstract: Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.

Abstract: Various embodiments include a solder preform for diffusion soldering comprising a sandwich structure having a multiplicity of first layers and a multiplicity of second layers alternating with one another in the sandwich structure. The first layers each comprise a metal foil. The second layers each comprise metal particles and a binder forming a paste.