Abstract: A method for operating a burner, comprising supplying a controlled quantity of combustion air to the burner, supplying a controlled quantity of fuel to the burner, igniting the air-fuel mixture in the burner, determining a pressure pulsation value in the exhaust gas downstream of the burner and/or in an air path upstream of the burner, and adjusting the quantity of combustion air and/or the fuel depending on the pressure pulsation value. Further proposed are a computing unit and a computer program product for performing such a method.

Abstract: A power semiconductor package includes: a die carrier having first and second opposite sides; and first and second power semiconductor dies each having first and second power electrodes on opposite sides. The second power electrodes face and are electrically coupled to the first side of the carrier. A molded body at least partially encapsulates the dies and has a first and second opposite sides and lateral sides connecting the first and second sides. First and second power contacts and first and second control contacts are arranged laterally next to each other. The first power electrode of the first die is electrically coupled to the first power contact by a first electrical connector. The first power electrode of the second die is electrically coupled to the second power contact by a second electrical connector. A width of each power contact is at least four times the width of each control contact.

Abstract: A composite assembly of three stacked joining partners, and a corresponding method. The three stacked joining partners are materially bonded to one another by an upper solder layer and a lower solder layer. An upper joining partner and a lower joining partner are fixed in their height and have a specified distance from one another. The upper solder layer is fashioned from a first solder agent, having a first melt temperature, between the upper joining partner and a middle joining partner. The second solder layer is fashioned from a second solder agent, having a higher, second melt temperature, between the middle joining partner and the lower joining partner. The upper joining partner has an upwardly open solder compensating opening filled with the first solder agent, from which, to fill the gap between the upper joining partner and the middle joining partner, the first solder agent subsequently flows into the gap.

Abstract: An electrical and/or electronic component including at least one electrical outside connecting contact. This contact is a terminal lug, which is attached at one side, for the electrical contacting with a contacting partner. The terminal lug includes a connecting side including a planar connecting surface for the electrical contacting. The exposed end of the terminal lug includes a bending leg, which is bent out of the plane by a compensating angle toward the connecting side. The bending leg includes the connecting surface. The terminal lug is designed such that, when a contacting partner, which is planar at least in this area, makes site contact with the free end of the bending leg with a force applied from the connecting side, a position orientation of the connecting surface is adaptable counter to the compensating angle until a gap-free contact is made between the connecting surface and the planar contacting partner.

Abstract: A composite assembly of three stacked joining partners, and a corresponding method. The three stacked joining partners are materially bonded to one another by an upper solder layer and a lower solder layer. An upper joining partner and a lower joining partner are fixed in their height and have a specified distance from one another. The upper solder layer is fashioned from a first solder agent, having a first melt temperature, between the upper joining partner and a middle joining partner. The second solder layer is fashioned from a second solder agent, having a higher, second melt temperature, between the middle joining partner and the lower joining partner. The upper joining partner has an upwardly open solder compensating opening filled with the first solder agent, from which, to fill the gap between the upper joining partner and the middle joining partner, the first solder agent subsequently flows into the gap.