Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: A method and device for crosstalk compensation includes evaluating skew for lengths of the two electrical paths. An integrated circuit is coupled to the two electrical paths, and the integrated circuit includes a global crosstalk compensation element integrated therewith which globally compensates for crosstalk on all lengths of portions of the two electrical paths.

Abstract: An electrical device includes a plurality of interconnects passing through a plane. The interconnects have a longitudinal axis substantially perpendicular to the plane and including an arrangement pattern which reduces or eliminates cross-talk between nearest neighboring interconnects, wherein the interconnects include a first differentially driven signal conductor pair and at least one other signal conductor, and the arrangement includes the at least one other signal conductor disposed at a substantially same distance from each conductor of the first differentially driven signal conductor pair.

Abstract: An RF device includes a signal layer disposed over a ground plane having radio frequency (RF) transmission lines configured and dimensioned to provide impedance matching along the RF lines. A shield is formed as a part of the RF lines and disposed below the RF choke of a DC current supply to form an intermediate capacitance between the choke and the shield to control parasitic effects.

Abstract: A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Abstract: The present invention relates to a method for monitoring biotechnological processes involving microorganisms, said method being characterized in that both the process medium and the microorganisms are directly spectroscoped in said medium by means of attenuated total reflection (ATR) at an ATR crystal whereby microorganisms come at least to a distance from the ATR crystal which corresponds to the evanescent field's depth of penetration, IR spectroscopy being carried out during this time interval, thereupon the microorganisms-containing medium being removed from the ATR crystal which then is washed and its contact is optionally renewed with the microorganisms-containing process medium, and moreover the invention relates to apparatus with which to carry out said method.