Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

Abstract: A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

Abstract: In a capacitively operating MEMS microphone, by varying the BIAS voltage, the pull-in point is determined and the present pull-in voltage and the corresponding pull-in capacitance between membrane and back electrode are ascertained. From the deviation of the present pull-in point from the values of a first pull-in point, these values being determined after an end test and stored in an internal memory of the MEMS microphone, and the likewise stored values at a first operating point a recalibrated BIAS voltage is determined and set in order thereby to bring the sensitivity closer again to that at the original first operating point.

Abstract: In a capacitively operating MEMS microphone, by varying the BIAS voltage, the pull-in point is determined and the present pull-in voltage and the corresponding pull-in capacitance between membrane and back electrode are ascertained. From the deviation of the present pull-in point from the values of a first pull-in point, these values being determined after an end test and stored in an internal memory of the MEMS microphone, and the likewise stored values at a first operating point a recalibrated BIAS voltage is determined and set in order thereby to bring the sensitivity closer again to that at the original first operating point.

Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).

Abstract: A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (MO) and a collapse mode (M1). The mode controller switches to the collapse mode (M1) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (MO) when the output signal reaches or falls below a predefined further threshold value (S1).

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.