Abstract: A pressure sensor for determining a pressure of a medium is configured to be screwed into a hydraulic control block, and includes a sleeve-shaped connector stub and sensor element. The stub has a plurality of axial sections, and an axial through bore configured to receive the medium. The axial sections include a threaded section, flange section, carrier section, and tapered portion. The flange section has an annular face facing the threaded section and configured to bear against a surface of the control block. The carrier section includes an inner opening that opens into the bore. The sensor element is positioned on the opening to sealingly close the opening, and is configured to measure the pressure of the medium. The tapered portion defines a reduction in a radial external diameter of the stub between the flange section and the carrier section.

Abstract: A pressure sensor for determining a pressure of a medium is configured to be screwed into a hydraulic control block, and includes a sleeve-shaped connector stub and sensor element. The stub has a plurality of axial sections, and an axial through bore configured to receive the medium. The axial sections include a threaded section, flange section, carrier section, and tapered portion. The flange section has an annular face facing the threaded section and configured to bear against a surface of the control block. The carrier section includes an inner opening that opens into the bore. The sensor element is positioned on the opening to sealingly close the opening, and is configured to measure the pressure of the medium. The tapered portion defines a reduction in a radial external diameter of the stub between the flange section and the carrier section.

Abstract: A micromechanical device for projecting an image and for analyzing an optical spectrum and a corresponding manufacturing method. The device includes: a first light providing unit by which a first light beam is providable to the device; a diffraction unit for diffract the first light beam provided to the device as a function of a diffraction property of the diffraction unit; a second light providing unit by which a second light beam is providable to the device; a micromirror by which the second light beam provided to the device is variably deflectable as a function of a position and/or an orientation of the first micromirror; and a first actuator by which the adjustable diffraction property of the optical diffraction unit and also the position and/or the orientation of the micromirror are adjustable.

Abstract: A micromechanical device for projecting an image and for analyzing an optical spectrum and a corresponding manufacturing method. The device includes: a first light providing unit by which a first light beam is providable to the device; a diffraction unit for diffract the first light beam provided to the device as a function of a diffraction property of the diffraction unit; a second light providing unit by which a second light beam is providable to the device; a micromirror by which the second light beam provided to the device is variably deflectable as a function of a position and/or an orientation of the first micromirror; and a first actuator by which the adjustable diffraction property of the optical diffraction unit and also the position and/or the orientation of the micromirror are adjustable.

Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.

Abstract: A micromechanical system having at least one micromechanical device, in particular a sensor device and/or an actuator device, the micromechanical system having a substrate on which at least one micromechanical device is provided, the micromechanical device having at least one structured or unstructured film adhesive on at least one side.

Abstract: A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.

Abstract: The invention relates to a method for a coupling device (1) for connecting an electrical/electronic component (16), in particular a sensor (17), having a substrate, in particular a circuit board, wherein the coupling device (1) comprises at least one electrical connection (25) for electrical contacting and at least one damper element (12) for movement uncoupling, wherein the electrical connection is formed by a lead frame (3) and the lead frame (3) is overmolded in regions by a damping mass (11) as a damper element (12). The invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly.

Abstract: A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

Abstract: A micromechanical system having at least one micromechanical device, in particular a sensor device and/or an actuator device, the micromechanical system having a substrate on which at least one micromechanical device is provided, the micromechanical device having at least one structured or unstructured film adhesive on at least one side.

Abstract: A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.