Abstract: A method includes: pouring a liquid, semi-liquid or viscous material into a cavity formed by sidewalls of a housing, to cover a substrate that is arranged in the cavity formed by the sidewalls; arranging a lid on the sidewalls, to cover the cavity formed by the sidewalls, the lid including at least one functional element that extends from the lid into the liquid, semi-liquid or viscous material in a direction towards the substrate once the lid is in a final mounting position; and curing the liquid, semi-liquid or viscous material, to form a casting compound.

Abstract: A terminal element or bus bar for a power semiconductor module arrangement includes a first end configured to be arranged inside a housing of the power semiconductor module arrangement, a second end configured to be arranged outside of the housing of the power semiconductor module arrangement, and at least a first section and a second section arranged successively between the first end and the second end along a length of the terminal element or bus bar, wherein either the first section includes a first material, the second section includes a second material, and the first material differs from the second material, or the first section has a first thickness, the second section has a second thickness, and the first thickness differs from the second thickness, or both.

Abstract: A measuring assembly for detecting intermodulations which limits the source of the intermodulations includes a first measuring device including a signal generation device and a signal measuring device. The signal generation device is designed to generate test signals and to output the test signals at an output connection, and the signal measuring device is designed to measure signals that are applied at the output connection. The assembly further includes a second measuring device with an input connection and a signal measuring device. The signal measuring device of the second measuring device is designed to measure signals that are applied at the input connection. The assembly further includes a directional coupler coupled to the first measuring device and the second measuring device.

Abstract: What is provided is an arrangement for electrically contacting electrically conductive elements, comprising a first element, at least a portion of which is electrically conductive, at least one second element, at least a portion of which is electrically conductive, for electrically contacting the first element, comprising a contact area in at least one end region thereof, the contact area having a radius at least at predefined contact points. The first electrically conductive element has at least one area that is designed to receive at least a portion of the contact area of the second electrically conductive element such that an electrical contact is created between the first electrically conductive element and the contact points of the second electrically conductive element. Furthermore, a corresponding first and second element is provided.

Abstract: A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.

Abstract: What is provided is an arrangement for electrically contacting electrically conductive elements, comprising a first element, at least a portion of which is electrically conductive, at least one second element, at least a portion of which is electrically conductive, for electrically contacting the first element, comprising a contact area in at least one end region thereof, the contact area having a radius at least at predefined contact points. The first electrically conductive element has at least one area that is designed to receive at least a portion of the contact area of the second electrically conductive element such that an electrical contact is created between the first electrically conductive element and the contact points of the second electrically conductive element. Furthermore, a corresponding first and second element is provided.

Abstract: A method for producing a material-bonding connection between a semiconductor chip and a metal layer is disclosed. For this purpose, a semiconductor chip, a metal layer, which has a chip mounting portion, and also a bonding medium containing a metal powder are provided. The metal powder is sintered in a sintering process. In this case, throughout a prescribed sintering time, the prescribed requirements are met, that the bonding medium is arranged between the semiconductor chip and the metal layer and extends right through from the semiconductor chip to the metal layer, that the semiconductor chip and the metal layer are pressed against one another in a pressing-pressure range that lies above a minimum pressing pressure, that the bonding medium is kept in a temperature range that lies above a minimum temperature and that a sound signal is introduced into the bonding medium.

Abstract: A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side. A thickness of the baseplate is locally reduced in a region of the depression. The power semiconductor module further includes a circuit carrier arranged above the depression on the top side of the baseplate such that the depression is interposed between the circuit carrier and the underside of the baseplate.

Abstract: A method and an apparatus for ultrasonic welding of a first workpiece to a second workpiece is disclosed. The two workpieces are clamped between a sonotrode and an anvil so that the two workpieces are in mechanical contact with each other, the first workpiece is in mechanical contact with the sonotrode and the second workpiece rests on the anvil. Fluid is introduced between the second workpiece and the anvil so that the second workpiece at least partly rests on the fluid. Ultrasonic vibrations are applied to the first workpiece by the sonotrode for a period of time.

Abstract: A roof module (10) of a motor vehicle roof (2), especially of a passenger car (1), which is mounted on a fixed body structure and which forms the top of the motor vehicle roof (2), to increase utility, the roof module is provided with guide rails (18) for movable attachment of at least one roof module component (17, 23, 26).

Abstract: A roof module (10) of a motor vehicle roof (2), especially of a passenger car (1), which is mounted on a fixed body structure and which forms the top of the motor vehicle roof (2), to increase utility, the roof module is provided with guide rails (18) for movable attachment of at least one roof module component (17, 23, 26).